Inventor · disambiguated record
Kodai Okoshi
Also filed as: OKOSHI KODAI
2 granted patents·0 citations·filing 2014–2014
24Inventor score
Technology areasH10W
Files withNAMICS CORP2
Top patents by PatentIndex Score
2 records- 0143US10196513B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Feb 5, 2019·0 cites·15 claims
- 0242US9947604B2Epoxy resin composition, semiconductor sealing agent, and semiconductor deviceNAMICS CORP·Filed 2014·Granted Apr 17, 2018·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →