Inventor
AHN DONG-HO
KR49 patents
⚠️ This page may combine multiple inventors who share the name “AHN DONG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
35 patentsUS6596607B2Jul 22, 2003
Method of forming a trench type isolation layer
SAMSUNG ELECTRONICS CO LTD111 citations98
US6383877B1May 7, 2002
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD49 citations96
US6717231B2Apr 6, 2004
Trench isolation regions having recess-inhibiting layers therein that protect against overetching
SAMSUNG ELECTRONICS CO LTD52 citations95
US6461937B1Oct 8, 2002
Methods of forming trench isolation regions having recess-inhibiting layers therein that protect against overetching
SAMSUNG ELECTRONICS CO LTD78 citations95
US7558100B2Jul 7, 2009
Phase change memory devices including memory cells having different phase change materials and related methods and systems
SAMSUNG ELECTRONICS CO LTD31 citations93
US6342451B1Jan 29, 2002
Method of fabricating floating gates in semiconductor device
SAMSUNG ELECTRONICS CO LTD20 citations93
US5804491ASep 8, 1998
Combined field/trench isolation region fabrication methods
SAMSUNG ELECTRONICS CO LTD30 citations93
US7800095B2Sep 21, 2010
Phase-change memory device having phase change material pattern shared between adjacent cells and electronic product including the phase-change memory
SAMSUNG ELECTRONICS CO LTD35 citations92
US6699799B2Mar 2, 2004
Method of forming a semiconductor device
SAMSUNG ELECTRONICS CO LTD36 citations92
US6624496B2Sep 23, 2003
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD29 citations92
US6482715B2Nov 19, 2002
Method of forming shallow trench isolation layer in semiconductor device
SAMSUNG ELECTRONICS CO LTD48 citations92
US5926721AJul 20, 1999
Isolation method for semiconductor device using selective epitaxial growth
SAMSUNG ELECTRONICS CO LTD19 citations92
US7824954B2Nov 2, 2010
Methods of forming phase change memory devices having bottom electrodes
SAMSUNG ELECTRONICS CO LTD21 citations91
US6159823ADec 12, 2000
Trench isolation method of semiconductor device
SAMSUNG ELECTRONICS CO LTD56 citations91
US7767568B2Aug 3, 2010
Phase change memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations84
US6881645B2Apr 19, 2005
Method of preventing semiconductor layers from bending and semiconductor device formed thereby
SAMSUNG ELECTRONICS CO LTD13 citations84
US10186552B2Jan 22, 2019
Variable resistance memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD11 citations82
US7112849B2Sep 26, 2006
Method of preventing semiconductor layers from bending and semiconductor device formed thereby
SAMSUNG ELECTRONICS CO LTD10 citations74
US6093622AJul 25, 2000
Isolation method of semiconductor device using second pad oxide layer formed through chemical vapor deposition (CVD)
SAMSUNG ELECTRONICS CO LTD10 citations74
US10403681B2Sep 3, 2019
Memory device including a variable resistance material layer
SAMSUNG ELECTRONICS CO LTD6 citations73
US10388867B2Aug 20, 2019
Variable resistance memory devices
SAMSUNG ELECTRONICS CO LTD2 citations73
US10236444B2Mar 19, 2019
Variable resistance memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US9318700B2Apr 19, 2016
Method of manufacturing a phase change memory device
SAMSUNG ELECTRONICS CO LTD3 citations73
US10224371B2Mar 5, 2019
Memory device
SAMSUNG ELECTRONICS CO LTD2 citations72
US10128312B2Nov 13, 2018
Non-volatile memory device
SAMSUNG ELECTRONICS CO LTD4 citations72
US8039297B2Oct 18, 2011
Plasma treating methods of fabricating phase change memory devices, and memory devices so fabricated
SAMSUNG ELECTRONICS CO LTD6 citations72
US5837595ANov 17, 1998
Methods of forming field oxide isolation regions with reduced susceptibility to polysilicon residue defects
SAMSUNG ELECTRONICS CO LTD9 citations72
US7759668B2Jul 20, 2010
Memory device including phase-changeable material region and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7638788B2Dec 29, 2009
Phase change memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US10403818B2Sep 3, 2019
Method of forming semiconductor devices having threshold switching devices
SAMSUNG ELECTRONICS CO LTD1 citations61
US10636968B2Apr 28, 2020
Variable resistance memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8021977B2Sep 20, 2011
Methods of forming contact structures and semiconductor devices fabricated using contact structures
SAMSUNG ELECTRONICS CO LTD0 citations52
US10714685B2Jul 14, 2020
Methods of forming semiconductor devices having threshold switching devices
SAMSUNG ELECTRONICS CO LTD0 citations51
US10546894B2Jan 28, 2020
Memory device
SAMSUNG ELECTRONICS CO LTD0 citations51
US5641705AJun 24, 1997
Device isolation method of semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations51
HYUNDAI MOBIS CO LTD
5 patentsUS6918570B2Jul 19, 2005
Anti-lock brake equipment solenoid valve
HYUNDAI MOBIS CO LTD45 citations93
US6644621B2Nov 11, 2003
Anti-lock brake system solenoid valve
HYUNDAI MOBIS CO LTD24 citations89
US6840499B2Jan 11, 2005
Solenoid controlled valve of anti-lock brake system
HYUNDAI MOBIS CO LTD15 citations84
US6988707B2Jan 24, 2006
Anti-lock brake equipment solenoid valve
HYUNDAI MOBIS CO LTD10 citations74
US6971858B2Dec 6, 2005
Anti-lock brake system pump housing
HYUNDAI MOBIS CO LTD4 citations63