Inventor
TAN ZAVIER ZAI YEONG
SG3 patents
Patents
3 patentsUS11854888B2Dec 26, 2023
Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach
APPLIED MATERIALS INC0 citations60
US11011424B2May 18, 2021
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
APPLIED MATERIALS INC0 citations58
US11901232B2Feb 13, 2024
Automatic kerf offset mapping and correction system for laser dicing
APPLIED MATERIALS INC0 citations57