Inventor

SHERRER DAVID W

US91 patents

⚠️ This page may combine multiple inventors who share the name “SHERRER DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHERRER DAVID W

NUVOTRONICS LLC

Coaxial transmission line microstructures and methods of formation thereof

Three-dimensional microstructures and methods of formation thereof

Coaxial waveguide microstructure having conductive and insulation materials defining voids therein

Optoelectronic component comprising an encapsulant

Device package and methods for the fabrication and testing thereof

Device package and methods for the fabrication and testing thereof

High frequency power combiner/divider

Device package and methods for the fabrication and testing thereof

Device package and methods for the fabrication and testing thereof

Batch fabricated microconnectors

Integrated electronic components and methods of formation thereof

Device package and methods for the fabrication and testing thereof

Integrated electronic components and methods of formation thereof

Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section

SHIPLEY CO LLC

Microstructures comprising silicon nitride layer and thin conductive polysilicon layer

Open face optical fiber array for coupling to integrated optic waveguides and optoelectronic submounts

Optical waveguide termination with vertical and horizontal mode shaping

Optical fiber array for preventing flow of glue between fibers and waveguide

Fiber array with V-groove chip and mount

Micromachined, etalon-based optical fiber pressure sensor

2-Dimensional optical fiber array made from etched sticks having notches

Optoelectronic packages having insulation layers

Optical device package for flip-chip mounting

Inductive magnetic recording head having inclined magnetic read/write pole and method of making same

Optical device package

Single mask technique for making positive and negative micromachined features on a substrate

Wafer level packaging for optoelectronic devices

Single mask lithographic process for patterning multiple types of surface features

ROHM & HAAS ELECT MAT

Wafer-level optoelectronic device substrate

Optoelectronic component with encapsulant

Coaxial waveguide microstructures having an active device and methods of formation thereof

Coaxial waveguide microstructures and methods of formation thereof

Coaxial waveguide microstructures having an active device and methods of formation thereof

Device package and method for the fabrication and testing thereof

Device package and methods for the fabrication and testing thereof

Optoelectronic component having electrical connection and formation method thereof

Optoelectronic component having passively aligned optoelectronic device

Optical device package having optical feedthrough

SHERRER DAVID W

Coaxial waveguide microstructures having an active device and methods of formation thereof

Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector

Batch fabricated microconnectors

Devices and methods for solder flow control in three-dimensional microstructures

SAMSUNG ELECTRONICS CO LTD

Optoelectronic component with flip-chip mounted optoelectronic device

GETZ JAMES W

Electronic device packages and methods of formation

NUVOTRONICS PLLC

Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof

CUBIC CORP

Broadband antenna array

NUVOTORNICS LLC

Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof

ACT MICRODEVICES INC

V-groove chip with wick-stop trench for improved fiber positioning

ROHM AND HAAS ELECTRONICS MATE

Optical interface assembly and method of formation

NUVOTRONICS INC

Device package and methods for the fabrication and testing thereof