US7288758B2ExpiredUtilityPatentIndex 99
Wafer-level optoelectronic device substrate
Est. expiryNov 25, 2018(expired)· nominal 20-yr term from priority
G02B 6/4246G02B 6/4214G02B 6/4292G02B 6/4274G02B 6/4231G02B 6/4249G02B 6/4257G02B 6/4232G02B 6/4201G02B 6/4204
99
PatentIndex Score
475
Cited by
21
References
19
Claims
Abstract
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Claims
exact text as granted — not AI-modified1. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device flip-chip mounted thereon.
2. The wafer-level optoelectronic device substrate of claim 1 , wherein the substrate is a silicon wafer.
3. The wafer-level optoelectronic device substrate of claim 1 , further comprising an encapsulant over each of the optoelectronic devices.
4. The wafer-level optoelectronic device substrate of claim 1 , wherein the optoelectronic device is a light emitting diode.
5. The wafer-level optoelectronic device substrate of claim 1 , further comprising a driver in each of the substrate portions.
6. The wafer-level optoelectronic device substrate of claim 1 , wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
7. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises:
an optoelectronic device mounted on the substrate; and
an electrical conductor extending from a front surface of the substrate to a back surface of the substrate in electrical communication with the optoelectronic device for passing signals to the optoelectronic device.
8. The wafer-level optoelectronic device substrate of claim 7 , wherein the substrate is a silicon wafer.
9. The wafer-level optoelectronic device substrate of claim 7 , further comprising an encapsulant over each of the optoelectronic devices.
10. The wafer-level optoelectronic device substrate of claim 7 , wherein the optoelectronic device is a light emitting diode.
11. The wafer-level optoelectronic device substrate of claim 7 , further comprising a driver in each substrate portion.
12. The wafer-level optoelectronic device substrate of claim 7 , wherein each of the substrate portions comprises a plurality of optoelectronic devices mounted thereon.
13. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises:
a trench in a surface thereof; and
an optoelectronic device mounted on the substrate in the trench; and
an encapsulant over the optoelectronic device forming a surface thereover, wherein the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
14. The wafer-level optoelectronic device substrate of claim 13 , wherein the substrate is a silicon wafer.
15. The wafer-level optoelectronic device substrate of claim 13 , wherein the optoelectronic device is a light emitting diode.
16. A wafer-level optoelectronic device substrate, comprising:
a substrate having a plurality of substrate portions, wherein each of the substrate portions comprises an optoelectronic device mounted thereon and an encapsulant over the optoelectronic device, wherein the encapsulant forms a surface over the optoelectronic device and the optoelectronic device substrate has an optical path which passes through the encapsulant surface.
17. The wafer-level optoelectronic device substrate of claim 16 , wherein the substrate is a silicon wafer.
18. The wafer-level optoelectronic device substrate of claim 16 , further comprising a driver in each substrate portion.
19. The wafer-level optoelectronic device substrate of claim 16 , wherein the optoelectronic device is a light emitting diode.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.