Inventor
GOODLIN BRIAN E
US25 patents
⚠️ This page may combine multiple inventors who share the name “GOODLIN BRIAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
18 patentsUS7833895B2Nov 16, 2010
TSVS having chemically exposed TSV tips for integrated circuit devices
TEXAS INSTRUMENTS INC24 citations92
US10009001B2Jun 26, 2018
Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same
TEXAS INSTRUMENTS INC22 citations91
US9896330B2Feb 20, 2018
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC12 citations90
US10233074B2Mar 19, 2019
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC4 citations82
US7229869B2Jun 12, 2007
Method for manufacturing a semiconductor device using a sidewall spacer etchback
TEXAS INSTRUMENTS INC11 citations82
US9524881B2Dec 20, 2016
Method for fabricating specific termination angles in titanium tungsten layers
TEXAS INSTRUMENTS INC6 citations81
US7018888B2Mar 28, 2006
Method for manufacturing improved sidewall structures for use in semiconductor devices
TEXAS INSTRUMENTS INC16 citations81
US9583336B1Feb 28, 2017
Process to enable ferroelectric layers on large area substrates
TEXAS INSTRUMENTS INC8 citations80
US10840179B2Nov 17, 2020
Electronic devices with bond pads formed on a molybdenum layer
TEXAS INSTRUMENTS INC2 citations72
US11498831B2Nov 15, 2022
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC1 citations71
US10723616B2Jul 28, 2020
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
TEXAS INSTRUMENTS INC2 citations71
US11075157B2Jul 27, 2021
IC having trench-based metal-insulator-metal capacitor
TEXAS INSTRUMENTS INC2 citations70
US9607847B1Mar 28, 2017
Enhanced lateral cavity etch
TEXAS INSTRUMENTS INC2 citations70
US8962350B2Feb 24, 2015
Multi-step deposition of ferroelectric dielectric material
TEXAS INSTRUMENTS INC2 citations63
US8026177B2Sep 27, 2011
Silicon dioxide cantilever support and method for silicon etched structures
TEXAS INSTRUMENTS INC1 citations62
US11616011B2Mar 28, 2023
IC having trench-based metal-insulator-metal capacitor
TEXAS INSTRUMENTS INC0 citations59
US9305998B2Apr 5, 2016
Adhesion of ferroelectric material to underlying conductive capacitor plate
TEXAS INSTRUMENTS INC0 citations48
US10570006B2Feb 25, 2020
Infrared sensor design using an epoxy film as an infrared absorption layer
TEXAS INSTRUMENTS INC0 citations47
MEINEL WALTER B
3 patentsUS9157807B2Oct 13, 2015
Etching cavity structures in silicon under dielectric membrane
MEINEL WALTER B0 citations51
US8114779B2Feb 14, 2012
Silicon dioxide cantilever support and method for silicon etched structures
MEINEL WALTER B0 citations51
US8115272B2Feb 14, 2012
Silicon dioxide cantilever support and method for silicon etched structures
MEINEL WALTER B0 citations51