Inventor
LOWRY ROBERT K
US19 patents
⚠️ This page may combine multiple inventors who share the name “LOWRY ROBERT K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HARRIS CORP
10 patentsUS5849627ADec 15, 1998
Bonded wafer processing with oxidative bonding
HARRIS CORP178 citations99
US5569620AOct 29, 1996
Bonded wafer processing with metal silicidation
HARRIS CORP194 citations99
US5387555AFeb 7, 1995
Bonded wafer processing with metal silicidation
HARRIS CORP149 citations99
US5517047AMay 14, 1996
Bonded wafer processing
HARRIS CORP53 citations96
US5362667ANov 8, 1994
Bonded wafer processing
HARRIS CORP93 citations96
US5728624AMar 17, 1998
Bonded wafer processing
HARRIS CORP52 citations92
US4272986AJun 16, 1981
Method and means for measuring moisture content of hermetic semiconductor devices
HARRIS CORP38 citations92
US5808353ASep 15, 1998
Radiation hardened dielectric for EEPROM
HARRIS CORP13 citations71
US4859280AAug 22, 1989
Method of etching silicon by enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions
HARRIS CORP7 citations69
US4781853ANov 1, 1988
Method of enhancing silicon etching capability of alkali hydroxide through the addition of positive valence impurity ions
HARRIS CORP9 citations69
INTERSIL CORP
5 patentsUS6909146B1Jun 21, 2005
Bonded wafer with metal silicidation
INTERSIL CORP25 citations92
US6054012AApr 25, 2000
Decapsulating method and apparatus for integrated circuit packages
INTERSIL CORP9 citations74
US6130172AOct 10, 2000
Radiation hardened dielectric for EEPROM
INTERSIL CORP7 citations71
USRE43980EFeb 5, 2013
Laser decapsulation method
INTERSIL CORP1 citations63
USRE42193EMar 1, 2011
Laser decapsulation method
INTERSIL CORP1 citations63