Inventor

SCHERL PETER

DE17 patents

⚠️ This page may combine multiple inventors who share the name “SCHERL PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHERL PETER

INFINEON TECHNOLOGIES AG

Smart card module arrangement

Multi-purpose non-linear semiconductor package assembly line

Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the same

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Semiconductor package having a thermally and electrically conductive spacer

Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same

Solder stop feature for electronic devices

Cover structure with integrated chip and antenna

Electronic device and method of fabricating an electronic device

Method of forming a bondpad and bondpad

Electronic device and method for fabricating an electronic device

Chip arrangement and a method for manufacturing a chip arrangement

Smart card module for a smart card

Semiconductor package with power electronics carrier having trench spacing adapted for delamination

GRUENAUER MATTHIAS

Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay

Document for personal identification having protection against external manipulations and a method for producing