Inventor
YAKOBSON ERIC
US29 patents
⚠️ This page may combine multiple inventors who share the name “YAKOBSON ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACDERMID INC
8 patentsUS5935640AAug 10, 1999
Method for enhancing the solderability of a surface
MACDERMID INC46 citations96
US5733599AMar 31, 1998
Method for enhancing the solderability of a surface
MACDERMID INC53 citations96
US6200451B1Mar 13, 2001
Method for enhancing the solderability of a surface
MACDERMID INC39 citations92
US5518760AMay 21, 1996
Composition and method for selective plating
MACDERMID INC28 citations92
US5468515ANov 21, 1995
Composition and method for selective plating
MACDERMID INC31 citations92
US5759378AJun 2, 1998
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC32 citations91
US5632927AMay 27, 1997
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC24 citations91
US5536386AJul 16, 1996
Process for preparing a non-conductive substrate for electroplating
MACDERMID INC23 citations91
ENTHONE
5 patentsUS7232478B2Jun 19, 2007
Adhesion promotion in printed circuit boards
ENTHONE16 citations90
US7393781B2Jul 1, 2008
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE10 citations84
US7332193B2Feb 19, 2008
Cobalt and nickel electroless plating in microelectronic devices
ENTHONE16 citations83
US7268074B2Sep 11, 2007
Capping of metal interconnects in integrated circuit electronic devices
ENTHONE9 citations73
US7682432B2Mar 23, 2010
Adhesion promotion in printed circuit boards
ENTHONE3 citations60
MACDERMID ENTHONE INC
5 patentsUS11035048B2Jun 15, 2021
Cobalt filling of interconnects
MACDERMID ENTHONE INC3 citations70
US11401618B2Aug 2, 2022
Cobalt filling of interconnects
MACDERMID ENTHONE INC0 citations59
US12157944B2Dec 3, 2024
Method and wet chemical compositions for diffusion barrier formation
MACDERMID ENTHONE INC0 citations56
US11846018B2Dec 19, 2023
Method and wet chemical compositions for diffusion barrier formation
MACDERMID ENTHONE INC0 citations56
US12270121B2Apr 8, 2025
Composition and method for fabrication of nickel interconnects
MACDERMID ENTHONE INC0 citations49