Inventor

TU CHIA-WEI

TW36 patents

⚠️ This page may combine multiple inventors who share the name “TU CHIA-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TU CHIA-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Method and apparatus for packaging pad structure

Plurality of different size metal layers for a pad structure

Plurality of different size metal layers for a pad structure

Integrated circuit packages and methods for forming the same

Plurality of different size metal layers for a pad structure

Integrated circuit packages and methods for forming the same

Integrated circuit packages and methods for forming the same

Methods and apparatus of packaging semiconductor devices

Reliability testing method

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Plurality of different size metal layers for a pad structure

Reliability testing method and apparatus

Integrated circuit packages and methods for forming the same

Wafer with liquid molding compound and post-passivation interconnect

Semiconductor package and method of manufacturing the same

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Methods and apparatus of packaging semiconductor devices

Packaging structures of integrated circuits

INGENTEC CORP

Magnetic light-emitting structure

Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element

Alignment module for transferring a magnetic light-emitting die and alignment method thereof

Light-emitting diode packaging structure and method for fabricating the same

Vertical type light emitting diode die and method for fabricating the same

Vertical type light emitting diode die and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG

Directly sawing wafers covered with liquid molding compound

Post-passivation interconnect structure and methods for forming the same

Packaging devices, methods of manufacture thereof, and packaging methods

Methods and apparatus of packaging semiconductor devices

Methods and apparatus of packaging semiconductor devices

TU CHIA-WEI

Integrated circuit packages and methods for forming the same

Methods and apparatus of under bump metallization in packaging semiconductor devices

LU WEN-HSIUNG

Semiconductor package having protective layer with curved surface and method of manufacturing same

UNIV NATIONAL CHIAO TUNG

Method for manufacturing micro light-emitting diode chips

WU YI-WEN

Methods and apparatus of packaging semiconductor devices

SU SHIANG-RUEI

Test chip, test board and reliability testing method