Inventor

CHOCKALINGAM RAMASAMY

SG20 patents

⚠️ This page may combine multiple inventors who share the name “CHOCKALINGAM RAMASAMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOCKALINGAM RAMASAMY

GLOBALFOUNDRIES SG PTE LTD

Bond pad reliability of semiconductor devices

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the same

Three electrode capacitor structure using spaced conductive pillars

Semiconductor memory devices having an electrode with an extension

Contact pad structures and methods for fabricating contact pad structures

Bonding structures of semiconductor devices

Method of forming a sensor device having moisture sensitive dielectric layer with integrally formed projections

Method of forming a sensor device

Bond pads of semiconductor devices

Structure for capacitor having defect-preventing regions in metal electrode

Test pad with crack stop protection

Bond pad reliability of semiconductor devices

Via disguise to protect the security product from delayering and graphic design system (GDS) hacking and method for producing the same

SRAM bit cells with three-dimensional integration

CHARTERED SEMICONDUCTOR MFG

CMP process utilizing dummy plugs in damascene process

Method to avoid copper contamination during copper etching and CMP

Method to reduce microloading in metal etching

PATTI ROBERT

Method for bonding wafers to produce stacked integrated circuits

TEZZARON SEMICONDUCTOR INC

Method for bonding wafers to produce stacked integrated circuits

GLOBALFOUNDRIES INC

Chamfering for stress reduction on passivation layer