Inventor
YU CHI-YANG
TW42 patents
Patents
42 patentsUS10157871B1Dec 18, 2018
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US11244879B2Feb 8, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US9865566B1Jan 9, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9812410B2Nov 7, 2017
Lid structure for a semiconductor device package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US12165946B2Dec 10, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11855057B2Dec 26, 2023
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424220B2Aug 23, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11315862B2Apr 26, 2022
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11145639B2Oct 12, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11127644B2Sep 21, 2021
Planarization of semiconductor packages and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10957672B2Mar 23, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10804245B2Oct 13, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10790210B2Sep 29, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10700031B2Jun 30, 2020
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10522436B2Dec 31, 2019
Planarization of semiconductor packages and structures resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10276508B2Apr 30, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157863B2Dec 18, 2018
Method for forming a lid structure for a semiconductor device package
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10141201B2Nov 27, 2018
Integrated circuit packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9666556B2May 30, 2017
Flip chip packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11705408B2Jul 18, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12368112B2Jul 22, 2025
Electronic component and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12347802B2Jul 1, 2025
Die corner removal for underfill crack suppression in semiconductor die packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12062604B2Aug 13, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11824032B2Nov 21, 2023
Die corner removal for underfill crack suppression in semiconductor die packaging
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11749594B2Sep 5, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11387118B2Jul 12, 2022
Integrated circuit packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9941186B2Apr 10, 2018
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12230589B2Feb 18, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908835B2Feb 20, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11784106B2Oct 10, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11616037B2Mar 28, 2023
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508640B2Nov 22, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11355461B2Jun 7, 2022
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11264304B2Mar 1, 2022
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011431B2May 18, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417968B2Sep 16, 2025
Package structure and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658263B2May 19, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10622278B2Apr 14, 2020
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269679B2Apr 23, 2019
Semiconductor structure and associated method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12412862B2Sep 9, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10777467B2Sep 15, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10468307B2Nov 5, 2019
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51