Inventor
LIU QIANFA
CN8 patents
⚠️ This page may combine multiple inventors who share the name “LIU QIANFA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHENGYI TECHNOLOGY CO LTD
7 patentsUS12466937B2Nov 11, 2025
Resin composition and use thereof
SHENGYI TECHNOLOGY CO LTD0 citations56
US12378386B2Aug 5, 2025
Resin composition and application thereof
SHENGYI TECHNOLOGY CO LTD0 citations56
US11261305B2Mar 1, 2022
Thermosetting resin composition, prepreg, laminate, and printed circuit board
SHENGYI TECHNOLOGY CO LTD0 citations56
US11053352B2Jul 6, 2021
Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board
SHENGYI TECHNOLOGY CO LTD1 citations56
US11945924B2Apr 2, 2024
Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same
SHENGYI TECHNOLOGY CO LTD0 citations55
US11744013B2Aug 29, 2023
Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same
SHENGYI TECHNOLOGY CO LTD0 citations44
US10400058B2Sep 3, 2019
Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
SHENGYI TECHNOLOGY CO LTD0 citations36