Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same

Abstract

The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

The invention claimed is: 
     
       1. A copper clad laminate comprising at least one fluorine-containing dielectric sheet and metal foil(s) covered on one or both sides of the laminated fluorine-containing dielectric sheet, wherein the copper clad laminate has a Dk (10 GHz) of 3.15 or less; a Df (10 GHz) is 0.0010 or less; and a breakdown voltage is 50 kV or more;
 wherein the fluorine-containing dielectric sheet comprising a fluorine-containing resin composition; 
 the fluorine-containing resin composition, comprising 30 wt. %-70 wt. % of a fluorine-containing polymer, and 30 wt. %-70 wt. % of an inorganic filler, wherein the inorganic filler includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm; 
 wherein the inorganic filler further includes the following particle size distribution: D90 is less than 30 μm; and D100 is less than 50 μm; and 
 wherein the inorganic filler has a specific surface area less than or equal to 3.0 m 2 /g. 
 
     
     
       2. The copper clad laminate claimed in  claim 1 , wherein the inorganic filler comprises an inorganic filler treated with a silane coupling agent. 
     
     
       3. The copper clad laminate claimed in  claim 1 , wherein the fluorine-containing polymer is any one selected from the group consisting of polytetrafluoroethylene, polyperfluoroethylene propylene, tetrafluoro-ethylene-perfluoroalkoxy vinyl ether copolymer, ethylene-tetrafluoroethylene copolymer, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer and derivatives thereof, polyvinylidene fluoride and derivatives thereof, and a combination of at least two selected therefrom. 
     
     
       4. The copper clad laminate claimed in  claim 1 , wherein the fluorine-containing resin composition further comprises a surfactant;
 the surfactant is added in an amount of 1 wt. %-10 wt. %. 
 
     
     
       5. A printed circuit board comprising the copper clad laminate claimed in  claim 1 . 
     
     
       6. The copper clad laminate claimed in  claim 1 , wherein the inorganic filler is a spherical inorganic filler. 
     
     
       7. The copper clad laminate claimed in  claim 1 , wherein the inorganic filler comprises any one of SiO 2 , Al 2 O 3 , TiO 2 , BaTiO 3 , SrTiO 3 , AlN, BN, Si 3 N 4 , SiC, CaTiO 3 , ZnTiO 3 , BaSnO 3 , hollow glass beads, chopped glass fiber powder, chopped quartz fiber powder, and a combination of at least two selected therefrom. 
     
     
       8. The copper clad laminate claimed in  claim 2 , wherein the silane coupling agent comprises a combination of a polar coupling agent and a non-polar coupling agent. 
     
     
       9. The copper clad laminate claimed in  claim 8 , wherein the polar coupling agent and the non-polar coupling agent has a mass ratio of 1:5-1:1. 
     
     
       10. The copper clad laminate claimed in  claim 8 , wherein the non-polar coupling agent comprises a fluorine-containing silane coupling agent. 
     
     
       11. The copper clad laminate claimed in  claim 8 , wherein the polar coupling agent comprises any one selected from the group consisting of an amino silane coupling agent, an epoxy silane coupling agent, a borate coupling agent, a zirconate coupling agent, a phosphate coupling agent, and a combination of at least two selected therefrom. 
     
     
       12. The copper clad laminate claimed in  claim 8 , wherein the silane coupling agent comprises a combination of a fluorine-containing silane coupling agent and an epoxy silane coupling agent. 
     
     
       13. The copper clad laminate claimed in  claim 2 , wherein the amount of the silane coupling agent in the inorganic filler treated with a silane coupling agent accounts for 0.05 wt. % to 5 wt. % of the inorganic filler. 
     
     
       14. The copper clad laminate claimed in  claim 1 , wherein a magnetic substance content of the inorganic filler is less than 50 ppm.