Inventor · disambiguated record
Songgang Chai
Also filed as: CHAI SONGGANG
6 granted patents·5 pending applications·0 citations·filing 2011–2022
64Inventor score
Top patents by PatentIndex Score
11 records- 0174US12466937B2Resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 0264US12378386B2Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·16 claims
- 0357US11945924B2Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 0457US10053547B2Thermosetting resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Aug 21, 2018·0 cites·19 claims
- 0554US2024010810A1Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 0652US2023202126A1Low dielectric loss non-woven fabric, preparation method thereof and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0749US2016243798A1Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 0847US10208188B2Thermosetting resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Feb 19, 2019·0 cites·17 claims
- 0946US2025368791A1Non-woven fabric prepreg, metal-foil-clad plate and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 1036US2018346675A1Thermosetting resin composition, prepreg containing same, laminated board, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 1132US9475970B2Epoxy resin composition and copper clad laminate manufactured by using sameDU CUIMING·Filed 2011·Granted Oct 25, 2016·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →