Inventor

CHOI YUN HWA

KR39 patents

⚠️ This page may combine multiple inventors who share the name “CHOI YUN HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI YUN HWA

JMJ KOREA CO LTD

Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin

Semiconductor package having exposed heat sink for high thermal conductivity

Semiconductor package with clip structure

Semiconductor package

Semiconductor package

Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same

Semiconductor package having double-sided heat dissipation structure

Clip structure for semiconductor package and semiconductor package including the same

Semiconductor package and method of manufacturing the same

Semiconductor package

Method of manufacturing semiconductor having double-sided substrate

Plurality of power semiconductor chips between a substrate and leadframe

Semiconductor package and method of manufacturing the same

Semiconductor package with heat radiation board

Heat sink board for a semiconductor device

Vertically attaching a chip to a substrate

Pressurizing members for semiconductor package

Heat sink board, manufacturing method thereof, and semiconductor package including the same

Clip structure and semiconductor package using the same

Ultrasonic welding system and power module package for power converting apparatus to which substrate where connection member is ultrasonic welded by using the same is applied

Apparatus for attaching semiconductor parts

Semiconductor package module including vertical terminals

System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the system

Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined

Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor package

Semiconductor package with metal post having non-vertical structure

Coupled semiconductor package

Metal powder layers between substrate, semiconductor chip and conductor

Multilayer clip structure attached to a chip

Low-cost semiconductor package using conductive metal structure

Press-fit pin and semiconductor package including the same

Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same

FAIRCHILD KR SEMICONDUCTOR LTD

Power module having stacked flip-chip and method of fabricating the power module

Power module having stacked flip-chip and method for fabricating the power module

SAMSUNG ELECTRONICS CO LTD

Method of allocating frequency subband and apparatus adopting the same

Method of allocating frequency subband and apparatus adopting the same

CHOI YUN-HWA

Location tracking method in coordinator-based wireless network

Location tracking method in coordinator-based wireless network

LIM SEUNG-WON

Power module having stacked flip-chip and method of fabricating the power module