Inventor
SCHOENFELD AARON
US50 patents
⚠️ This page may combine multiple inventors who share the name “SCHOENFELD AARON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
47 patentsUS6344976B1Feb 5, 2002
Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC202 citations99
US6148509ANov 21, 2000
Method for supporting an integrated circuit die
MICRON TECHNOLOGY INC221 citations99
US6069506AMay 30, 2000
Method and apparatus for improving the performance of digital delay locked loop circuits
MICRON TECHNOLOGY INC175 citations99
US5973935AOct 26, 1999
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die
MICRON TECHNOLOGY INC202 citations99
US6704881B1Mar 9, 2004
Method and apparatus for providing symmetrical output data for a double data rate DRAM
MICRON TECHNOLOGY INC71 citations98
US6858472B2Feb 22, 2005
Method for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC39 citations96
US6348400B1Feb 19, 2002
Method and apparatus for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC26 citations96
US6324657B1Nov 27, 2001
On-clip testing circuit and method for improving testing of integrated circuits
MICRON TECHNOLOGY INC56 citations96
US6316976B1Nov 13, 2001
Method and apparatus for improving the performance of digital delay locked loop circuits
MICRON TECHNOLOGY INC69 citations96
US6137334AOct 24, 2000
Logic circuit delay stage and delay line utilizing same
MICRON TECHNOLOGY INC53 citations96
US6066515AMay 23, 2000
Multilevel leadframe for a packaged integrated circuit
MICRON TECHNOLOGY INC53 citations96
US6004838ADec 21, 1999
ESD protection using selective siliciding techniques
MICRON TECHNOLOGY INC45 citations96
US5903443AMay 11, 1999
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC33 citations96
US5614856AMar 25, 1997
Waveshaping circuit generating two rising slopes for a sense amplifier pulldown device
MICRON TECHNOLOGY INC84 citations94
US7237136B2Jun 26, 2007
Method and apparatus for providing symmetrical output data for a double data rate DRAM
MICRON TECHNOLOGY INC18 citations93
US6816994B2Nov 9, 2004
Low power buffer implementation
MICRON TECHNOLOGY INC16 citations93
US6462404B1Oct 8, 2002
Multilevel leadframe for a packaged integrated circuit
MICRON TECHNOLOGY INC19 citations93
US6351040B1Feb 26, 2002
Method and apparatus for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC22 citations93
US6107677AAug 22, 2000
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC22 citations93
US5744839AApr 28, 1998
ESD protection using selective siliciding techniques
MICRON TECHNOLOGY INC20 citations93
US6392458B1May 21, 2002
Method and apparatus for digital delay locked loop circuits
MICRON TECHNOLOGY INC29 citations92
US6359482B1Mar 19, 2002
Method and apparatus for digital delay locked loop circuits
MICRON TECHNOLOGY INC23 citations92
US6271582B1Aug 7, 2001
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC11 citations82
US7421607B2Sep 2, 2008
Method and apparatus for providing symmetrical output data for a double data rate DRAM
MICRON TECHNOLOGY INC8 citations74
US6831353B2Dec 14, 2004
Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die
MICRON TECHNOLOGY INC5 citations74
US6787889B2Sep 7, 2004
Multilevel leadframe for a packaged integrated circuit and method of fabrication
MICRON TECHNOLOGY INC10 citations74
US6707096B2Mar 16, 2004
Fork-like memory structure for ULSI DRAM and method of fabrication
MICRON TECHNOLOGY INC5 citations74
US6674177B2Jan 6, 2004
Apparatus for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC7 citations74
US6617692B2Sep 9, 2003
Apparatus for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC7 citations74
US6576987B2Jun 10, 2003
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC3 citations74
US6472764B2Oct 29, 2002
Method and apparatus for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC4 citations74
US6215172B1Apr 10, 2001
Grinding technique for integrated circuits
MICRON TECHNOLOGY INC8 citations74
US6127245AOct 3, 2000
Grinding technique for integrated circuits
MICRON TECHNOLOGY INC7 citations74
US6052289AApr 18, 2000
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die
MICRON TECHNOLOGY INC15 citations74
US6008996ADec 28, 1999
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC7 citations74
US5977616ANov 2, 1999
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
MICRON TECHNOLOGY INC6 citations74
US6828230B2Dec 7, 2004
Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same
MICRON TECHNOLOGY INC6 citations72
US6941526B2Sep 6, 2005
Low power buffer implementation
MICRON TECHNOLOGY INC3 citations63
US6780680B2Aug 24, 2004
Methods of fabricating multilevel leadframes and semiconductor devices
MICRON TECHNOLOGY INC3 citations63
US6724033B1Apr 20, 2004
Fork-like memory structure for ULSI DRAM
MICRON TECHNOLOGY INC3 citations63
US6699734B2Mar 2, 2004
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC2 citations63
US6600215B1Jul 29, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC1 citations63
US6010932AJan 4, 2000
Fork-like memory structure for ULSI DRAM and method of fabrication
MICRON TECHNOLOGY INC3 citations63
US6396727B1May 28, 2002
Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same
MICRON TECHNOLOGY INC5 citations61
US6897569B2May 24, 2005
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device
MICRON TECHNOLOGY INC0 citations52
US6635560B2Oct 21, 2003
Method for implementing selected functionality on an integrated circuit device
MICRON TECHNOLOGY INC0 citations52
US6579746B2Jun 17, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC0 citations52