Inventor

KONGPOUNG CHANAPAT

TH2 patents

Patents

2 patents

US10242953B1Mar 26, 2019

Semiconductor package with plated metal shielding and a method thereof

UTAC HEADQUARTERS PTE LTD7 citations77

US10600741B1Mar 24, 2020

Semiconductor package with plated metal shielding and a method thereof

UTAC HEADQUARTERS PTE LTD0 citations45