Inventor · disambiguated record
Sukhvinder S. Kang
Also filed as: KANG SUKHVINDER · KANG SUKHVINDER S · KANG SUKHVINDER SINGH
30 granted patents·6 pending applications·1,396 citations·filing 1992–2022
98Inventor score
Top patents by PatentIndex Score
36 records- 0198US12050061B2Shrouded powder patchAAVID THERMALLOY LLC·Filed 2021·Granted Jul 30, 2024·7 cites·24 claims
- 0297US7176508B2Temperature sensor for high power very large scale integration circuitsIBM·Filed 2004·Granted Feb 13, 2007·130 cites·22 claims
- 0394US9042100B2System and method for cooling heat generating componentsAAVID THERMALLOY LLC·Filed 2013·Granted May 26, 2015·24 cites·20 claims
- 0494US5757998AMultigigabit adaptable transceiver moduleIBM·Filed 1996·Granted May 26, 1998·136 cites·40 claims
- 0590US5630469ACooling apparatus for electronic chipsIBM·Filed 1995·Granted May 20, 1997·136 cites·5 claims
- 0689US5870286AHeat sink assembly for cooling electronic modulesIBM·Filed 1997·Granted Feb 9, 1999·92 cites·8 claims
- 0788US11650015B2Method and apparatus for thermosiphon deviceAAVID THERMALLOY LLC·Filed 2021·Granted May 16, 2023·1 cites·23 claims
- 0888US5940266ABi-directional cooling arrangement for use with an electronic component enclosureIBM·Filed 1997·Granted Aug 17, 1999·76 cites·11 claims
- 0987US6542359B2Apparatus and method for cooling a wearable computerIBM·Filed 2000·Granted Apr 1, 2003·52 cites·23 claims
- 1086US8286693B2Heat sink base plate with heat pipeWHITNEY BRADLEY R·Filed 2008·Granted Oct 16, 2012·18 cites·25 claims
- 1186US5978223ADual heat sink assembly for cooling multiple electronic modulesIBM·Filed 1998·Granted Nov 2, 1999·87 cites·13 claims
- 1285US10989483B2Thermosiphon with multiport tube and flow arrangementAAVID THERMALLOY LLC·Filed 2017·Granted Apr 27, 2021·5 cites·31 claims
- 1385US6233959B1Dehumidified cooling assembly for IC chip modulesIBM·Filed 1999·Granted May 22, 2001·63 cites·5 claims
- 1485US6125036AMoisture barrier seals for cooled IC chip module assembliesIBM·Filed 1999·Granted Sep 26, 2000·77 cites·11 claims
- 1583US6061240APush pin assembly for heat sink for cooling electronic modulesIBM·Filed 1998·Granted May 9, 2000·61 cites·3 claims
- 1682US10054371B2Thermosiphon with integrated componentsAAVID THERMALLOY LLC·Filed 2017·Granted Aug 21, 2018·3 cites·34 claims
- 1780US6000623ASystem packaging for high performance computer applicationsIBM·Filed 1998·Granted Dec 14, 1999·98 cites·9 claims
- 1880US5923531AEnhanced circuit board arrangement for a computerIBM·Filed 1997·Granted Jul 13, 1999·50 cites·6 claims
- 1979US6084775AHeatsink and package structures with fusible release layerIBM·Filed 1998·Granted Jul 4, 2000·54 cites·35 claims
- 2078US6243268B1Cooled IC chip modules with an insulated circuit boardIBM·Filed 1999·Granted Jun 5, 2001·52 cites·7 claims
- 2171US6246581B1Heated PCB interconnect for cooled IC chip modulesIBM·Filed 1999·Granted Jun 12, 2001·39 cites·8 claims
- 2271US5339695AFluidic gas flowmeter with large flow metering rangeGAS RES INST·Filed 1992·Granted Aug 23, 1994·38 cites·25 claims
- 2368US7306027B2Fluid-containing cooling plate for an electronic componentAAVID THERMALLOY LLC·Filed 2004·Granted Dec 11, 2007·11 cites·23 claims
- 2466US10655920B2Thermosiphon with bent tube sectionAAVID THERMALLOY LLC·Filed 2015·Granted May 19, 2020·1 cites·16 claims
- 2565US6233960B1Spot cooling evaporator cooling system for integrated circuit chip modulesIBM·Filed 1999·Granted May 22, 2001·30 cites·8 claims
- 2662US5342825APassive superconducting bearing systemUS ARMY·Filed 1993·Granted Aug 30, 1994·23 cites·8 claims
- 2751US5347876AGas flowmeter using thermal time-of-flight principleGAS RES INST·Filed 1992·Granted Sep 20, 1994·17 cites·16 claims
- 2850US6122926ALow thermal conductance insulated cooling assembly for IC chip modulesIBM·Filed 1999·Granted Sep 26, 2000·15 cites·10 claims
- 2949US12495515B2Liquid cooled heat exchangerAAVID THERMALLOY LLC·Filed 2022·Granted Dec 9, 2025·0 cites·22 claims
- 3045US10077768B2Planar coil and support for actuator of fluid moverAAVID THERMALLOY LLC·Filed 2015·Granted Sep 18, 2018·0 cites·24 claims
- 3142US2015292774A1System and method for geothermal heat harvestingAAVID THERMALLOY LLC·Filed 2013·Application pending·0 cites
- 3238US2006096738A1Liquid cold plate heat exchangerAAVID THERMALLOY LLC·Filed 2005·Application pending·0 cites
- 3338US2005072558A1Heat sink assembly and connecting deviceAAVID THERMALLOY LLC·Filed 2004·Application pending·0 cites
- 3436US2016061532A1Evaporator and condenser section structure for thermosiphonAAVID THERMALLOY LLC·Filed 2015·Application pending·0 cites
- 3536US2014345829A1Thermal Transfer Device with Reduced Vertical ProfileKANG SUKHVINDER S·Filed 2011·Application pending·0 cites
- 3635US2016211191A1Heat sink assembly with frame clip for fully assembled attachment to heat generating componentAAVID THERMALLOY LLC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →