Inventor
OYAMADA TETSUYA
JP23 patents
⚠️ This page may combine multiple inventors who share the name “OYAMADA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MICROMETAL CORP
12 patentsUS12090578B2Sep 17, 2024
Al bonding wire
NIPPON MICROMETAL CORP2 citations72
US12581982B2Mar 17, 2026
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations62
US12532767B2Jan 20, 2026
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12388044B2Aug 12, 2025
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12132025B2Oct 29, 2024
Bonding wire
NIPPON MICROMETAL CORP0 citations62
US12334467B2Jun 17, 2025
Copper bonding wire
NIPPON MICROMETAL CORP0 citations61
US12412864B2Sep 9, 2025
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations60
US11342299B2May 24, 2022
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations60
US12463172B2Nov 4, 2025
AG alloy bonding wire for semiconductor devices and semiconductor device
NIPPON MICROMETAL CORP0 citations59
US12325901B2Jun 10, 2025
AI wiring material
NIPPON MICROMETAL CORP0 citations56
US10032741B2Jul 24, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP0 citations51
US12463171B2Nov 4, 2025
Copper bonding wire for semiconductor devices and semiconductor device
NIPPON MICROMETAL CORP0 citations49
NIPPON STEEL CHEMICAL & MAT CO LTD
10 patentsUS10381320B2Aug 13, 2019
Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
NIPPON STEEL CHEMICAL & MAT CO LTD6 citations82
US11612966B2Mar 28, 2023
Ag alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD2 citations70
US10991672B2Apr 27, 2021
Cu alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10985130B2Apr 20, 2021
Cu alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10950571B2Mar 16, 2021
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62
US10840208B2Nov 17, 2020
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD1 citations62
US10950570B2Mar 16, 2021
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations60
US10790259B2Sep 29, 2020
Cu alloy bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations52
US10529683B2Jan 7, 2020
Bonding wire for semiconductor device
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations52
US12166006B2Dec 10, 2024
Bonding wire for semiconductor devices
NIPPON STEEL CHEMICAL & MAT CO LTD0 citations51