Inventor

ODA DAIZO

JP46 patents

⚠️ This page may combine multiple inventors who share the name “ODA DAIZO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NIPPON MICROMETAL CORP

32 patents

US10137534B2Nov 27, 2018

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP5 citations84

US9773748B2Sep 26, 2017

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP5 citations84

US9887172B2Feb 6, 2018

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP6 citations83

US10737356B2Aug 11, 2020

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP1 citations73

US10610976B2Apr 7, 2020

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP1 citations73

US10414002B2Sep 17, 2019

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP1 citations73

US9543266B2Jan 10, 2017

Bonding wire for semiconductor device use and method of production of same

NIPPON MICROMETAL CORP2 citations73

US12090578B2Sep 17, 2024

Al bonding wire

NIPPON MICROMETAL CORP2 citations72

US11373934B2Jun 28, 2022

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP4 citations72

US12581982B2Mar 17, 2026

Bonding wire for semiconductor devices

NIPPON MICROMETAL CORP0 citations62

US12532767B2Jan 20, 2026

Al bonding wire

NIPPON MICROMETAL CORP0 citations62

US12388044B2Aug 12, 2025

Al bonding wire

NIPPON MICROMETAL CORP0 citations62

US12300658B2May 13, 2025

Copper alloy bonding wire for semiconductor devices

NIPPON MICROMETAL CORP0 citations62

US12132025B2Oct 29, 2024

Bonding wire

NIPPON MICROMETAL CORP0 citations62

US11929343B2Mar 12, 2024

Bonding wire for semiconductor devices

NIPPON MICROMETAL CORP1 citations62

US11721660B2Aug 8, 2023

Bonding wire for semiconductor devices

NIPPON MICROMETAL CORP1 citations62

US11101234B2Aug 24, 2021

Cu pillar cylindrical preform for semiconductor connection

NIPPON MICROMETAL CORP0 citations62

US10468370B2Nov 5, 2019

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP1 citations62

US9059003B2Jun 16, 2015

Power semiconductor device, method of manufacturing the device and bonding wire

NIPPON MICROMETAL CORP2 citations62

US12334467B2Jun 17, 2025

Copper bonding wire

NIPPON MICROMETAL CORP0 citations61

US12412864B2Sep 9, 2025

Bonding wire for semiconductor devices

NIPPON MICROMETAL CORP0 citations60

US11342299B2May 24, 2022

Bonding wire for semiconductor devices

NIPPON MICROMETAL CORP0 citations60

US12463172B2Nov 4, 2025

AG alloy bonding wire for semiconductor devices and semiconductor device

NIPPON MICROMETAL CORP0 citations59

US12325901B2Jun 10, 2025

AI wiring material

NIPPON MICROMETAL CORP0 citations56

US10672733B2Jun 2, 2020

Cu alloy core bonding wire with Pd coating for semiconductor device

NIPPON MICROMETAL CORP0 citations52

US10497663B2Dec 3, 2019

Cu alloy core bonding wire with Pd coating for semiconductor device

NIPPON MICROMETAL CORP0 citations52

US10236272B2Mar 19, 2019

Cu alloy core bonding wire with Pd coating for semiconductor device

NIPPON MICROMETAL CORP0 citations52

US9536854B2Jan 3, 2017

Bonding wire for semiconductor device use and method of production of same

NIPPON MICROMETAL CORP0 citations52

US12290883B2May 6, 2025

Bonding wire

NIPPON MICROMETAL CORP0 citations51

US10121758B2Nov 6, 2018

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP0 citations51

US10032741B2Jul 24, 2018

Bonding wire for semiconductor device

NIPPON MICROMETAL CORP0 citations51

US12463171B2Nov 4, 2025

Copper bonding wire for semiconductor devices and semiconductor device

NIPPON MICROMETAL CORP0 citations49

NIPPON STEEL CHEMICAL & MAT CO LTD

9 patents

US10381320B2Aug 13, 2019

Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium

NIPPON STEEL CHEMICAL & MAT CO LTD6 citations82

US11612966B2Mar 28, 2023

Ag alloy bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD2 citations70

US10991672B2Apr 27, 2021

Cu alloy bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62

US10985130B2Apr 20, 2021

Cu alloy bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62

US10950571B2Mar 16, 2021

Bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations62

US10840208B2Nov 17, 2020

Bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD1 citations62

US10790259B2Sep 29, 2020

Cu alloy bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations52

US10529683B2Jan 7, 2020

Bonding wire for semiconductor device

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations52

US12166006B2Dec 10, 2024

Bonding wire for semiconductor devices

NIPPON STEEL CHEMICAL & MAT CO LTD0 citations51

TERASHIMA SHINICHI

2 patents

US8742258B2Jun 3, 2014

Bonding wire for semiconductor

TERASHIMA SHINICHI9 citations82

US8097960B2Jan 17, 2012

Semiconductor mounting bonding wire

TERASHIMA SHINICHI0 citations50

UNO TOMOHIRO

2 patents

US9427830B2Aug 30, 2016

Copper alloy bonding wire for semiconductor

UNO TOMOHIRO1 citations52

US8815019B2Aug 26, 2014

Bonding wire for semiconductor

UNO TOMOHIRO1 citations51

NIPPON STEEL & SUMIKIN MAT CO

1 patent

US9812421B2Nov 7, 2017

Bonding wire for semiconductor devices

NIPPON STEEL & SUMIKIN MAT CO1 citations51