Inventor

FARNWORTH WARREN M

US756 patents

Patents

50 patents

US7498675B2Mar 3, 2009

Semiconductor component having plate, stacked dice and conductive vias

MICRON TECHNOLOGY INC292 citations99

US7221059B2May 22, 2007

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

MICRON TECHNOLOGY INC61 citations99

US7060526B2Jun 13, 2006

Wafer level methods for fabricating multi-dice chip scale semiconductor components

MICRON TECHNOLOGY INC96 citations99

US7029949B2Apr 18, 2006

Method for fabricating encapsulated semiconductor components having conductive vias

MICRON TECHNOLOGY INC141 citations99

US7026835B2Apr 11, 2006

Engagement probe having a grouping of projecting apexes for engaging a conductive pad

MICRON TECHNOLOGY INC109 citations99

US6998344B2Feb 14, 2006

Method for fabricating semiconductor components by forming conductive members using solder

MICRON TECHNOLOGY INC101 citations99

US6964915B2Nov 15, 2005

Semiconductor component and interconnect having conductive members and contacts on opposing sides

MICRON TECHNOLOGY INC246 citations99

US6858891B2Feb 22, 2005

Nanotube semiconductor devices and methods for making the same

MICRON TECHNOLOGY INC124 citations99

US6841883B1Jan 11, 2005

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

MICRON TECHNOLOGY INC659 citations99

US6833613B1Dec 21, 2004

Stacked semiconductor package having laser machined contacts

MICRON TECHNOLOGY INC106 citations99

US6794699B2Sep 21, 2004

Annular gate and technique for fabricating an annular gate

MICRON TECHNOLOGY INC172 citations99

US6715018B2Mar 30, 2004

Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer

MICRON TECHNOLOGY INC220 citations99

US6634100B2Oct 21, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC98 citations99

US6620731B1Sep 16, 2003

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

MICRON TECHNOLOGY INC293 citations99

US6614104B2Sep 2, 2003

Stackable semiconductor package having conductive layer and insulating layers

MICRON TECHNOLOGY INC220 citations99

US6593171B2Jul 15, 2003

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

MICRON TECHNOLOGY INC93 citations99

US6549821B1Apr 15, 2003

Stereolithographic method and apparatus for packaging electronic components and resulting structures

MICRON TECHNOLOGY INC145 citations99

US6544902B1Apr 8, 2003

Energy beam patterning of protective layers for semiconductor devices

MICRON TECHNOLOGY INC149 citations99

US6537482B1Mar 25, 2003

Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography

MICRON TECHNOLOGY INC91 citations99

US6529027B1Mar 4, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC118 citations99

US6524346B1Feb 25, 2003

Stereolithographic method for applying materials to electronic component substrates and resulting structures

MICRON TECHNOLOGY INC157 citations99

US6515325B1Feb 4, 2003

Nanotube semiconductor devices and methods for making the same

MICRON TECHNOLOGY INC175 citations99

US6501165B1Dec 31, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC249 citations99

US6482576B1Nov 19, 2002

Surface smoothing of stereolithographically formed 3-D objects

MICRON TECHNOLOGY INC116 citations99

US6465877B1Oct 15, 2002

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC166 citations99

US6461881B1Oct 8, 2002

Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures

MICRON TECHNOLOGY INC97 citations99

US6451624B1Sep 17, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC220 citations99

US6453377B1Sep 17, 2002

Computer including optical interconnect, memory unit, and method of assembling a computer

MICRON TECHNOLOGY INC85 citations99

US6437591B1Aug 20, 2002

Test interconnect for bumped semiconductor components and method of fabrication

MICRON TECHNOLOGY INC132 citations99

US6432752B1Aug 13, 2002

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

MICRON TECHNOLOGY INC95 citations99

US6400008B1Jun 4, 2002

Surface mount ic using silicon vias in an area array format or same size as die array

MICRON TECHNOLOGY INC108 citations99

US6400172B1Jun 4, 2002

Semiconductor components having lasered machined conductive vias

MICRON TECHNOLOGY INC222 citations99

US6368896B2Apr 9, 2002

Method of wafer level chip scale packaging

MICRON TECHNOLOGY INC267 citations99

US6359456B1Mar 19, 2002

Probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC149 citations99

US6326697B1Dec 4, 2001

Hermetically sealed chip scale packages formed by wafer level fabrication and assembly

MICRON TECHNOLOGY INC301 citations99

US6294837B1Sep 25, 2001

Semiconductor interconnect having laser machined contacts

MICRON TECHNOLOGY INC336 citations99

US6285204B1Sep 4, 2001

Method for testing semiconductor packages using oxide penetrating test contacts

MICRON TECHNOLOGY INC131 citations99

US6275052B1Aug 14, 2001

Probe card and testing method for semiconductor wafers

MICRON TECHNOLOGY INC118 citations99

US6246245B1Jun 12, 2001

Probe card, test method and test system for semiconductor wafers

MICRON TECHNOLOGY INC130 citations99

US6235554B1May 22, 2001

Method for fabricating stackable chip scale semiconductor package

MICRON TECHNOLOGY INC647 citations99

US6188232B1Feb 13, 2001

Temporary package, system, and method for testing semiconductor dice and chip scale packages

MICRON TECHNOLOGY INC229 citations99

US6169329B1Jan 2, 2001

Semiconductor devices having interconnections using standardized bonding locations and methods of designing

MICRON TECHNOLOGY INC304 citations99

US6168969B1Jan 2, 2001

Surface mount IC using silicon vias in an area array format or same size as die array

MICRON TECHNOLOGY INC128 citations99

US6124634ASep 26, 2000

Micromachined chip scale package

MICRON TECHNOLOGY INC328 citations99

US6114240ASep 5, 2000

Method for fabricating semiconductor components using focused laser beam

MICRON TECHNOLOGY INC522 citations99

US6107109AAug 22, 2000

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

MICRON TECHNOLOGY INC403 citations99

Showing the top 50 of 756 patents by PatentIndex Score.

FARNWORTH WARREN M

Patents

Semiconductor component having plate, stacked dice and conductive vias

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Method for fabricating encapsulated semiconductor components having conductive vias

Engagement probe having a grouping of projecting apexes for engaging a conductive pad

Method for fabricating semiconductor components by forming conductive members using solder

Method of fabricating encapsulated semiconductor components by etching

Hermetic chip in wafer form

Method for fabricating encapsulated semiconductor components

Semiconductor component having encapsulated, bonded, interconnect contacts

Semiconductor component and interconnect having conductive members and contacts on opposing sides

Nanotube semiconductor devices and methods for making the same

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Stacked semiconductor package having laser machined contacts

Annular gate and technique for fabricating an annular gate

Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer

Interposer and methods for fabricating same

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

Stackable semiconductor package having conductive layer and insulating layers

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Stereolithographic method and apparatus for packaging electronic components and resulting structures

Energy beam patterning of protective layers for semiconductor devices

Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography

Interposer and methods for fabricating same

Stereolithographic method for applying materials to electronic component substrates and resulting structures

Nanotube semiconductor devices and methods for making the same

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

Surface smoothing of stereolithographically formed 3-D objects

Semiconductor package including flex circuit, interconnects and dense array external contacts

Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

Computer including optical interconnect, memory unit, and method of assembling a computer

Test interconnect for bumped semiconductor components and method of fabrication

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Surface mount ic using silicon vias in an area array format or same size as die array

Semiconductor components having lasered machined conductive vias

Method of wafer level chip scale packaging

Probe card and test system for semiconductor wafers

Hermetically sealed chip scale packages formed by wafer level fabrication and assembly

Semiconductor interconnect having laser machined contacts

Method for testing semiconductor packages using oxide penetrating test contacts

Probe card and testing method for semiconductor wafers

Probe card, test method and test system for semiconductor wafers

Method for fabricating stackable chip scale semiconductor package

Temporary package, system, and method for testing semiconductor dice and chip scale packages

Semiconductor devices having interconnections using standardized bonding locations and methods of designing

Surface mount IC using silicon vias in an area array format or same size as die array

Micromachined chip scale package

Method for fabricating semiconductor components using focused laser beam

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate