Inventor · disambiguated record
Chung-Hsi Wu
Also filed as: WU CHUNG-HSI · WU CHUNG-HSI J
13 granted patents·24 citations·filing 2002–2022
86Inventor score
Files withADVANCED SEMICONDUCTOR ENG4IBM4TAIWAN SEMICONDUCTOR MFG2INFINEON TECHNOLOGIES AG1SHEN CHI-CHIH1
Top patents by PatentIndex Score
13 records- 0178US9064741B1Uniformity in wafer patterning using feedback controlTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·3 cites·20 claims
- 0272US12040312B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·6 claims
- 0367US7074525B2Critical dimension control of printed features using non-printing fill patternsIBM·Filed 2003·Granted Jul 11, 2006·11 cites·36 claims
- 0463US9960102B2Semiconductor devices and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 1, 2018·1 cites·20 claims
- 0561US7648805B2Masks and methods of manufacture thereofIBM·Filed 2006·Granted Jan 19, 2010·2 cites·23 claims
- 0660US6861209B2Method to enhance resolution of a chemically amplified photoresistIBM·Filed 2002·Granted Mar 1, 2005·7 cites·16 claims
- 0758US7859645B2Masks and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2009·Granted Dec 28, 2010·0 cites·20 claims
- 0854US11424212B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 23, 2022·0 cites·5 claims
- 0951US9362185B2Uniformity in wafer patterning using feedback controlTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·0 cites·20 claims
- 1050US8937015B2Method for forming vias in a substrateWANG MENG-JEN·Filed 2011·Granted Jan 20, 2015·0 cites·16 claims
- 1143US7407736B2Methods of improving single layer resist patterning schemeIBM·Filed 2006·Granted Aug 5, 2008·0 cites·5 claims
- 1242US9947635B1Semiconductor package, interposer and semiconductor process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 17, 2018·0 cites·20 claims
- 1337US8390129B2Semiconductor device with a plurality of mark through substrate viasSHEN CHI-CHIH·Filed 2010·Granted Mar 5, 2013·0 cites·18 claims
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