Inventor
STRONG VERONICA ALEMAN
US16 patents
Patents
16 patentsUS11147197B2Oct 12, 2021
Microelectronic package electrostatic discharge (ESD) protection
INTEL CORP5 citations84
US11527501B1Dec 13, 2022
Sacrificial redistribution layer in microelectronic assemblies having direct bonding
INTEL CORP7 citations83
US11424239B2Aug 23, 2022
Diodes for package substrate electrostatic discharge (ESD) protection
INTEL CORP2 citations73
US11348882B2May 31, 2022
Package spark gap structure
INTEL CORP3 citations73
US11296040B2Apr 5, 2022
Electrostatic discharge protection in integrated circuits
INTEL CORP2 citations73
US11264373B2Mar 1, 2022
Die backend diodes for electrostatic discharge (ESD) protection
INTEL CORP2 citations73
US11189580B2Nov 30, 2021
Electrostatic discharge protection in integrated circuits
INTEL CORP2 citations73
US11784181B2Oct 10, 2023
Die backend diodes for electrostatic discharge (ESD) protection
INTEL CORP0 citations62
US11751367B2Sep 5, 2023
Microelectronic package electrostatic discharge (ESD) protection
INTEL CORP0 citations62
US11676918B2Jun 13, 2023
Electrostatic discharge protection in integrated circuits
INTEL CORP0 citations62
US11289431B2Mar 29, 2022
Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity
INTEL CORP0 citations62
US11239155B2Feb 1, 2022
Conductive contact structures for electrostatic discharge protection in integrated circuits
INTEL CORP0 citations62
US11222856B2Jan 11, 2022
Package-integrated bistable switch for electrostatic discharge (ESD) protection
INTEL CORP0 citations62
US11749628B2Sep 5, 2023
Sacrificial redistribution layer in microelectronic assemblies having direct bonding
INTEL CORP0 citations59
US11621236B2Apr 4, 2023
Electrostatic discharge protection in integrated circuits using positive temperature coefficient material
INTEL CORP0 citations52
US11942334B2Mar 26, 2024
Microelectronic assemblies having conductive structures with different thicknesses
INTEL CORP0 citations50