Inventor

SUNOHARA MASAHIRO

JP121 patents

⚠️ This page may combine multiple inventors who share the name “SUNOHARA MASAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUNOHARA MASAHIRO

SHINKO ELECTRIC IND CO

Semiconductor wafer having a separation portion on a peripheral area

Electronic parts packaging structure and method of manufacturing the same

Wiring board mounting a capacitor

Semiconductor device

Semiconductor device and method of manufacturing the same

Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film

Interposer mounted wiring board and electronic component device

Semiconductor device

Wiring substrate and semiconductor device and method of manufacturing the same

Method of manufacturing substrate

Interposer and method for producing the same and electronic device

Electronic parts packaging structure and method of manufacturing the same

Electronic component embedded board and its manufacturing method

Interposer and method for producing the same and electronic device

Semiconductor device having through electrode and method of manufacturing the same

Electronic component device

Electronic component embedded substrate and method for manufacturing the same

Manufacturing method of an electronic part built-in substrate

Electronic parts packaging structure and method of manufacturing the same

Wiring board and method of manufacturing the same

Method for fabricating an electronic component embedded substrate

Electronic parts packaging structure and method of manufacturing the same

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Heat radiation package and semiconductor device

Method of manufacturing substrate

Electronic component and method for manufacturing the same

Electronic component and method for manufacturing the same

Method of manufacturing wiring board having a semiconductor thereon

Light-emitting device and method for manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Probe device

Semiconductor device and method of manufacturing the same

Semiconductor chip and method of manufacturing semiconductor chip

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Electronic parts built-in substrate and method of manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

Electronic parts packaging structure and method of manufacturing the same

Semiconductor package

Electronic parts packaging structure and method of manufacturing the same

SUNOHARA MASAHIRO

Method of manufacturing wiring substrate

Wiring board with switching function and method of manufacturing the same

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

SHINKO ELECTRIC IND

Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer

MURAYAMA KEI

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

MITSUBISHI ELECTRIC CORP

Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate

SHINKO ELECTRIC INDUTRIES CO L

Method of production of multilayer circuit board with built-in semiconductor chip