Manufacturing method of an electronic part built-in substrate

Abstract

A manufacturing method of an electronic part built-in substrate is disclosed, wherein an electronic part is contained in a build-up layer, the manufacturing method including a step for arranging an electronic part on a conductive supporting object such that the electronic part is electrically connected to the conductive supporting object, a step for forming build-up layers on the supporting object such that the electronic part is contained in the build-up layers, and a step for forming a wiring layer electrically connected to the electronic part by shaping the supporting object.

1. A manufacturing method of an electronic part built-in substrate that contains an electronic part in a build-up layer, comprising:
 a process of arranging the electronic part on a supporting object that consists of a conductive material so that the electronic part is electrically connected to the supporting object; 
 a process of forming a build-up layer on the supporting object on which the electronic part is arranged so that the electronic part is contained; and 
 a wiring formation process of forming a wiring layer connected to the electronic part by shaping the conductive supporting object, wherein the supporting object is shaped in the wiring formation process by using an etching method. 
 
   
   
     2. The manufacturing method of an electronic part built-in substrate as claimed in  claim 1 , wherein the first build-up layer forming process, and the 2nd build-up layer forming process use a semi additives method. 
   
   
     3. A manufacturing method of an electronic part built-in substrate that contains an electronic part in a build-up layer, comprising:
 a first build-up layer forming process of forming one or more build-up layers on a supporting object that consists of a conductive material, the build-up layers being laminated to a thickness equivalent to a thickness of the electronic part, constituting a first build-up layer; 
 a cavity formation process of forming a cavity for accommodating the electronic part in the build-up layers that are laminated; 
 an accommodation process of accommodating the electronic part to the cavity, 
 a second build-up layer forming process of forming a build-up layer further on the first build-up layer to which the cavity is formed, and on the electronic part; and 
 a wiring formation process of forming a wiring layer connected to the electronic part by shaping the conductive supporting object. 
 
   
   
     4. The manufacturing method of an electronic part built-in substrate as claimed in  claim 3 , wherein the supporting object is shaped in the wiring formation process by using an etching method. 
   
   
     5. The manufacturing method of an electronic part built-in substrate as claimed in  claim 3 , wherein the first build-up layer forming process, and the 2nd build-up layer forming process use a semi additives method.