Inventor · disambiguated record
Masahiro Sunohara
Also filed as: SUNOHARA MASAHIRO
120 granted patents·22 pending applications·1,572 citations·filing 2003–2025
99Inventor score
Top patents by PatentIndex Score
142 records- 0199US7709932B2Semiconductor wafer having a separation portion on a peripheral areaSHINKO ELECTRIC IND CO·Filed 2005·Granted May 4, 2010·270 cites·1 claims
- 0297US8379400B2Interposer mounted wiring board and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Feb 19, 2013·48 cites·7 claims
- 0397US7279771B2Wiring board mounting a capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 9, 2007·86 cites·5 claims
- 0496US7656023B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·37 cites·4 claims
- 0596US7122901B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 17, 2006·54 cites·7 claims
- 0695US8137497B2Method of manufacturing wiring substrateSUNOHARA MASAHIRO·Filed 2009·Granted Mar 20, 2012·38 cites·14 claims
- 0795US7678685B2Interposer and method for producing the same and electronic deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Mar 16, 2010·33 cites·7 claims
- 0895US7605463B2Interposer and method for producing the same and electronic deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 20, 2009·35 cites·6 claims
- 0995US7217888B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted May 15, 2007·79 cites·6 claims
- 1094US7727802B2Method for fabricating an electronic component embedded substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 1, 2010·33 cites·3 claims
- 1194US7285728B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 23, 2007·35 cites·4 claims
- 1293US7795140B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·28 cites·12 claims
- 1393US7508057B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·26 cites·10 claims
- 1493US7420128B2Electronic component embedded substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 2, 2008·29 cites·8 claims
- 1591US7952191B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted May 31, 2011·22 cites·8 claims
- 1691US7884484B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 8, 2011·24 cites·9 claims
- 1791US7640655B2Electronic component embedded board and its manufacturing methodSHINKO ELECTRIC IND CO·Filed 2006·Granted Jan 5, 2010·22 cites·5 claims
- 1891US6943442B2Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating filmSHINKO ELECTRIC IND CO·Filed 2003·Granted Sep 13, 2005·45 cites·7 claims
- 1990US7893524B2Wiring substrate and semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 22, 2011·19 cites·10 claims
- 2090US7524753B2Semiconductor device having through electrode and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 28, 2009·20 cites·12 claims
- 2189US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 2289US7214565B2Manufacturing method of an electronic part built-in substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted May 8, 2007·19 cites·5 claims
- 2389US6958544B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted Oct 25, 2005·46 cites·7 claims
- 2488US8080122B2Method of manufacturing wiring substrate and method of manufacturing semiconductor deviceSUNOHARA MASAHIRO·Filed 2009·Granted Dec 20, 2011·12 cites·9 claims
- 2588US7592700B2Semiconductor chip and method of manufacturing semiconductor chipSHINKO ELECTRIC IND CO·Filed 2006·Granted Sep 22, 2009·14 cites·2 claims
- 2688US7057290B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jun 6, 2006·30 cites·6 claims
- 2787US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 2887US7605080B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 20, 2009·15 cites·5 claims
- 2986US7507602B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 24, 2009·12 cites·15 claims
- 3086US7285862B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 23, 2007·27 cites·4 claims
- 3186US7198986B2Electronic parts built-in substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 3, 2007·13 cites·5 claims
- 3285US7667474B2Probe deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 23, 2010·9 cites·6 claims
- 3384US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 3483US7981798B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Jul 19, 2011·12 cites·5 claims
- 3583US7573135B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 11, 2009·6 cites·4 claims
- 3683US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 3783US7195988B2Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor waferSHINKO ELECTRIC IND·Filed 2004·Granted Mar 27, 2007·31 cites·7 claims
- 3882US8111523B2Wiring board with switching function and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Feb 7, 2012·10 cites·6 claims
- 3982US7563987B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Jul 21, 2009·10 cites·3 claims
- 4082US7498200B2Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 3, 2009·7 cites·12 claims
- 4181US7745939B2Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 29, 2010·10 cites·2 claims
- 4280US8368206B2Heat radiation package and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Feb 5, 2013·8 cites·14 claims
- 4379US8003895B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Aug 23, 2011·8 cites·3 claims
- 4479US7964950B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Jun 21, 2011·5 cites·4 claims
- 4579US7948092B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted May 24, 2011·8 cites·13 claims
- 4679US7882626B2Method of manufacturing wiring board having a semiconductor thereonSHINKO ELECTRIC IND CO·Filed 2009·Granted Feb 8, 2011·8 cites·20 claims
- 4778US8148738B2Semiconductor device having an element mounted on a substrate and an electrical component connected to the elementMURAYAMA KEI·Filed 2007·Granted Apr 3, 2012·8 cites·12 claims
- 4878US7894201B2Electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 22, 2011·9 cites·3 claims
- 4978US7829993B2Semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 9, 2010·6 cites·5 claims
- 5078US7545049B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 9, 2009·5 cites·6 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →