Inventor

SHIMIZU NORIYOSHI

JP113 patents

⚠️ This page may combine multiple inventors who share the name “SHIMIZU NORIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIMIZU NORIYOSHI

SHINKO ELECTRIC IND CO

Wiring substrate and semiconductor device

Semiconductor package, method of production of same, and semiconductor device

Method of fabricating substrate utilizing an electrophoretic deposition process

Semiconductor package, method of manufacturing the same, and semiconductor device

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Semiconductor package, method of manufacturing the same, and semiconductor device

Wiring substrate, semiconductor device, and method for manufacturing wiring substrate

Wiring board

Wiring substrate and method of manufacturing the same

Wiring board, semiconductor device, and method of manufacturing wiring board

Semiconductor package, semiconductor package manufacturing method and semiconductor device

Encapsulated electronic part packaging structure

Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate

Semiconductor package, method of production of same, and semiconductor device

Wiring substrate and semiconductor package

Wiring board, electronic component device, and method for manufacturing those

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Wiring board

Capacitor parts

Method of manufacturing wiring board

Method of manufacturing electronic part packaging structure

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Wiring board, and semiconductor device

Wiring substrate and method of making wiring substrate

Wiring substrate and semiconductor device

FUJITSU LTD

Semiconductor device with copper wiring and semiconductor device manufacturing method

Semiconductor device

Semiconductor device

Apparatus for fabricating semiconductor devices

Method of manufacturing semiconductor device suitable for forming wiring using damascene method

Method of forming wiring structure and semiconductor device

Method for manufacturing semiconductor device

Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device

Semiconductor device manufactured by the damascene process having improved stress migration resistance

Semiconductor device and method of manufacturing the same

Manufacture of semiconductor device with copper wiring

FUJITSU SEMICONDUCTOR LTD

Method of manufacturing semiconductor apparatus, and semiconductor apparatus

Manufacturing method of semiconductor device

Semiconductor device manufacturing method

Method of manufacturing semiconductor device suitable for forming wiring using damascene method

SEMICONDUCTOR TECH ACAD RES CT

Semiconductor device with a barrier film which contains manganese

Semiconductor device with a barrier film

SHIMIZU NORIYOSHI

Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch

Semiconductor package manufacturing method and semiconductor package

FUJITSU MICROELECTRONICS LTD

Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition

Fabrication process of a semiconductor device

HANEDA MASAKI

Method of manufacturing a multilayer interconnection structure in a semiconductor device

FURUMURA YUJI

Fluid heating-cooling cylinder device

PANASONIC IP MAN CO LTD

Stand-by power estimating apparatus and program