Inventor

LEE SEUNG-YEOP

KR26 patents

⚠️ This page may combine multiple inventors who share the name “LEE SEUNG-YEOP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE SEUNG-YEOP

SK HYNIX INC

Semiconductor packages including stacked chips

Semiconductor devices with optical through via structures, memory cards including the same, and electronic systems including the same

Semiconductor package including stacked semiconductor chips

Semiconductor package including stacked semiconductor chips

Stack packages including a fan-out sub-package

Semiconductor chip and semiconductor package having the same

Semiconductor device using wires and stacked semiconductor package

Semiconductor integrated circuit device including an electrostatic discharge protection circuit

Semiconductor package including stacked semiconductor chips

Stack packages including a supporting substrate

Semiconductor integrated circuit device including an electro-static discharge protection circuit

Flexible device including sliding interconnection structure

Internal reference voltage generation device

HYUNDAI MOTOR CO LTD

Apparatus and method for piston insertion

Apparatus and method for assembling an engine

Part assembling system of automation line

Dual release actuator for vehicle seat and method for controlling the same

KOREA ATOMIC ENERGY RES

Mineralogical method and apparatus for removal of aqueous cesium ion

Mineralogical removal method and apparatus for highly concentrated iodine in radioactive wastewater

RYU HO-HAN

Light guide plate stamp and method of manufacturing the same

LEE SEUNG-YEOP

Display apparatus and method of manufacturing the same

KANG SIN YOUNG

Method of preparing alkyl butyrate from fermented liquid using microorganisms

HYNIX SEMICONDUCTOR INC

Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same

LEE SEUNG YEOP

Multi-chip package cross-reference to related applications

SEO HYUN CHUL

Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines

SK INNOVATION CO LTD

Method for preparing organic acid by fed-batch-feeding carbon source substrate and base