Inventor
LO WAI YEW
MY30 patents
⚠️ This page may combine multiple inventors who share the name “LO WAI YEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
13 patentsUS6885093B2Apr 26, 2005
Stacked die semiconductor device
FREESCALE SEMICONDUCTOR INC80 citations95
US7160755B2Jan 9, 2007
Method of forming a substrateless semiconductor package
FREESCALE SEMICONDUCTOR INC58 citations94
US7554185B2Jun 30, 2009
Flip chip and wire bond semiconductor package
FREESCALE SEMICONDUCTOR INC21 citations85
US7452750B2Nov 18, 2008
Capacitor attachment method
FREESCALE SEMICONDUCTOR INC13 citations84
US7378298B2May 27, 2008
Method of making stacked die package
FREESCALE SEMICONDUCTOR INC14 citations84
US7955953B2Jun 7, 2011
Method of forming stacked die package
FREESCALE SEMICONDUCTOR INC8 citations83
US7741196B2Jun 22, 2010
Semiconductor wafer with improved crack protection
FREESCALE SEMICONDUCTOR INC9 citations83
US7531383B2May 12, 2009
Array quad flat no-lead package and method of forming same
FREESCALE SEMICONDUCTOR INC9 citations83
US7473586B1Jan 6, 2009
Method of forming flip-chip bump carrier type package
FREESCALE SEMICONDUCTOR INC15 citations83
US7211466B2May 1, 2007
Stacked die semiconductor device
FREESCALE SEMICONDUCTOR INC16 citations81
US7886609B2Feb 15, 2011
Pressure sensor package
FREESCALE SEMICONDUCTOR INC7 citations76
US7745260B2Jun 29, 2010
Method of forming semiconductor package
FREESCALE SEMICONDUCTOR INC7 citations74
US9698093B2Jul 4, 2017
Universal BGA substrate
FREESCALE SEMICONDUCTOR INC0 citations38
LO WAI YEW
9 patentsUS9297713B2Mar 29, 2016
Pressure sensor device with through silicon via
LO WAI YEW8 citations83
US8378435B2Feb 19, 2013
Pressure sensor and method of assembling same
LO WAI YEW16 citations83
US9362479B2Jun 7, 2016
Package-in-package semiconductor sensor device
LO WAI YEW5 citations72
US8941194B1Jan 27, 2015
Pressure sensor device having bump chip carrier (BCC)
LO WAI YEW4 citations70
US9029999B2May 12, 2015
Semiconductor sensor device with footed lid
LO WAI YEW2 citations62
US8283780B2Oct 9, 2012
Surface mount semiconductor device
LO WAI YEW2 citations57
US9638596B2May 2, 2017
Cavity-down pressure sensor device
LO WAI YEW0 citations51
US8546169B1Oct 1, 2013
Pressure sensor device and method of assembling same
LO WAI YEW0 citations49
US8460972B2Jun 11, 2013
Method of forming semiconductor package
LO WAI YEW0 citations41