Inventor
OH DAE BOK
KR25 patents
⚠️ This page may combine multiple inventors who share the name “OH DAE BOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
21 patentsUS9165713B2Oct 20, 2015
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations82
US10170242B2Jan 1, 2019
Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
SAMSUNG ELECTRO MECH2 citations73
US9576732B2Feb 21, 2017
Multilayer ceramic capacitor and mounting board therefor
SAMSUNG ELECTRO MECH4 citations73
US9129746B2Sep 8, 2015
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH5 citations72
US9978514B2May 22, 2018
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH2 citations71
US9159495B2Oct 13, 2015
Multilayer ceramic electronic component, manufacturing method thereof and board for mounting the same
SAMSUNG ELECTRO MECH5 citations69
US9595386B2Mar 14, 2017
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH4 citations67
US9177722B2Nov 3, 2015
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH2 citations63
US9030802B2May 12, 2015
Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same
SAMSUNG ELECTRO MECH2 citations63
US10629376B2Apr 21, 2020
Multilayer ceramic capacitor having side members
SAMSUNG ELECTRO MECH1 citations62
US10770226B2Sep 8, 2020
Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
SAMSUNG ELECTRO MECH0 citations52
US9595392B2Mar 14, 2017
Multilayer ceramic condenser and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US9520238B2Dec 13, 2016
Array-type multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH1 citations52
US9049798B2Jun 2, 2015
Multilayered ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH1 citations52
US9336944B2May 10, 2016
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH0 citations51
US9117592B2Aug 25, 2015
Multilayer ceramic electronic component and mounting board therefor
SAMSUNG ELECTRO MECH0 citations50
US9875850B2Jan 23, 2018
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations46
US9613752B2Apr 4, 2017
Multilayer ceramic electronic component and mounting board therefor
SAMSUNG ELECTRO MECH0 citations41
US9024199B2May 5, 2015
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH0 citations41
US9064639B2Jun 23, 2015
Multilayer ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH0 citations40
US9040840B2May 26, 2015
Multilayer ceramic electronic component and mounting board therefor
SAMSUNG ELECTRO MECH0 citations37