Multilayer ceramic electronic component and board for mounting the same

Abstract

A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5.

What is claimed is: 
     
       1. A multilayer ceramic electronic component, comprising:
 a ceramic body including a plurality of dielectric layers and a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; 
 a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body; and 
 first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface in which the recess portion is formed, and electrically connected to the first and second internal electrodes, respectively, 
 wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5. 
 
     
     
       2. The multilayer ceramic electronic component of  claim 1 , wherein the first and second internal electrodes have a thickness of 0.2 μm to 0.85 μm. 
     
     
       3. The multilayer ceramic electronic component of  claim 1 , wherein the first and second internal electrodes disposed in the lower region of the ceramic body have a thickness greater than that of the first and second internal electrodes disposed in the upper region of the ceramic body. 
     
     
       4. The multilayer ceramic electronic component of  claim 1 , wherein the ceramic body satisfies 1.2<T/W<3.0. 
     
     
       5. The multilayer ceramic electronic component of  claim 1 , wherein when a thickness of an edge portion of an end surface of the ceramic body is defined as Te and a thickness of a central portion of the end surface of the ceramic body is defined as Tc, 0.910≦Tc/Te<0.995 is satisfied. 
     
     
       6. The multilayer ceramic electronic component of  claim 1 , wherein the upper region of the ceramic body has electrode connectivity of 80% or more. 
     
     
       7. The multilayer ceramic electronic component of  claim 1 , wherein the lower region of the ceramic body has electrode connectivity of 90% or more. 
     
     
       8. The multilayer ceramic electronic component of  claim 1 , wherein a difference in electrode connectivity between the lower region and the upper region of the ceramic body is 5% or more. 
     
     
       9. The multilayer ceramic electronic component of  claim 1 , wherein the ceramic body has the dielectric layers stacked in a thickness direction. 
     
     
       10. The multilayer ceramic electronic component of  claim 1 , wherein the ceramic body has the dielectric layers stacked in a width direction. 
     
     
       11. The multilayer ceramic electronic component of  claim 1 , wherein the recess portion is provided in both main surfaces of the ceramic body in an opposing manner. 
     
     
       12. A board for mounting a multilayer ceramic electronic component, the board comprising:
 a printed circuit board having first and second electrode pads provided thereon; and 
 the multilayer ceramic electronic component of  claim 1  disposed on the first and second electrode pads.