Inventor
LEE CHU-CHUNG
US33 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHU-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
20 patentsUS7355289B2Apr 8, 2008
Packaged integrated circuit with enhanced thermal dissipation
FREESCALE SEMICONDUCTOR INC59 citations98
US7632715B2Dec 15, 2009
Method of packaging semiconductor devices
FREESCALE SEMICONDUCTOR INC44 citations92
US7572680B2Aug 11, 2009
Packaged integrated circuit with enhanced thermal dissipation
FREESCALE SEMICONDUCTOR INC24 citations92
US7049694B2May 23, 2006
Semiconductor package with crossing conductor assembly and method of manufacture
FREESCALE SEMICONDUCTOR INC15 citations92
US6992377B2Jan 31, 2006
Semiconductor package with crossing conductor assembly and method of manufacture
FREESCALE SEMICONDUCTOR INC25 citations92
US6933614B2Aug 23, 2005
Integrated circuit die having a copper contact and method therefor
FREESCALE SEMICONDUCTOR INC31 citations91
US7374971B2May 20, 2008
Semiconductor die edge reconditioning
FREESCALE SEMICONDUCTOR INC28 citations90
US6937047B2Aug 30, 2005
Integrated circuit with test pad structure and method of testing
FREESCALE SEMICONDUCTOR INC36 citations90
US9093383B1Jul 28, 2015
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC7 citations84
US7829997B2Nov 9, 2010
Interconnect for chip level power distribution
FREESCALE SEMICONDUCTOR INC9 citations84
US7821104B2Oct 26, 2010
Package device having crack arrest feature and method of forming
FREESCALE SEMICONDUCTOR INC10 citations84
US7750465B2Jul 6, 2010
Packaged integrated circuit
FREESCALE SEMICONDUCTOR INC9 citations84
US7550318B2Jun 23, 2009
Interconnect for improved die to substrate electrical coupling
FREESCALE SEMICONDUCTOR INC7 citations74
US8853867B2Oct 7, 2014
Encapsulant for a semiconductor device
FREESCALE SEMICONDUCTOR INC6 citations73
US7656045B2Feb 2, 2010
Cap layer for an aluminum copper bond pad
FREESCALE SEMICONDUCTOR INC3 citations63
US7256488B2Aug 14, 2007
Semiconductor package with crossing conductor assembly and method of manufacture
FREESCALE SEMICONDUCTOR INC3 citations62
US9461012B2Oct 4, 2016
Copper ball bond features and structure
FREESCALE SEMICONDUCTOR INC1 citations52
US9368470B2Jun 14, 2016
Coated bonding wire and methods for bonding using same
FREESCALE SEMICONDUCTOR INC0 citations51
US9331046B2May 3, 2016
Integrated circuit package with voltage distributor
FREESCALE SEMICONDUCTOR INC0 citations46
US9257403B2Feb 9, 2016
Copper ball bond interface structure and formation
FREESCALE SEMICONDUCTOR INC0 citations43
HESS KEVIN J
3 patentsCARPENTER BURTON J
2 patentsUS9437459B2Sep 6, 2016
Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
CARPENTER BURTON J41 citations93
US9324675B2Apr 26, 2016
Structures for reducing corrosion in wire bonds
CARPENTER BURTON J0 citations51