Inventor
TAN LAN CHU
MY32 patents
⚠️ This page may combine multiple inventors who share the name “TAN LAN CHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
10 patentsUS6933614B2Aug 23, 2005
Integrated circuit die having a copper contact and method therefor
FREESCALE SEMICONDUCTOR INC31 citations91
US6900531B2May 31, 2005
Image sensor device
FREESCALE SEMICONDUCTOR INC53 citations88
US7042098B2May 9, 2006
Bonding pad for a packaged integrated circuit
FREESCALE SEMICONDUCTOR INC33 citations87
US7741196B2Jun 22, 2010
Semiconductor wafer with improved crack protection
FREESCALE SEMICONDUCTOR INC9 citations83
US7384819B2Jun 10, 2008
Method of forming stackable package
FREESCALE SEMICONDUCTOR INC16 citations83
US7261230B2Aug 28, 2007
Wirebonding insulated wire and capillary therefor
FREESCALE SEMICONDUCTOR INC14 citations77
US9721928B1Aug 1, 2017
Integrated circuit package having two substrates
FREESCALE SEMICONDUCTOR INC4 citations72
US7160798B2Jan 9, 2007
Method of making reinforced semiconductor package
FREESCALE SEMICONDUCTOR INC8 citations71
US7494924B2Feb 24, 2009
Method for forming reinforced interconnects on a substrate
FREESCALE SEMICONDUCTOR INC2 citations58
US7985672B2Jul 26, 2011
Solder ball attachment ring and method of use
FREESCALE SEMICONDUCTOR INC0 citations51
FOONG CHEE SENG
6 patentsUS9202770B1Dec 1, 2015
Non-homogeneous molding of packaged semiconductor devices
FOONG CHEE SENG5 citations72
US9269659B1Feb 23, 2016
Interposer with overmolded vias
FOONG CHEE SENG2 citations62
US9053972B1Jun 9, 2015
Pillar bump formed using spot-laser
FOONG CHEE SENG0 citations51
US9474162B2Oct 18, 2016
Circuit substrate and method of manufacturing same
FOONG CHEE SENG0 citations41
US9401345B2Jul 26, 2016
Semiconductor device package with organic interposer
FOONG CHEE SENG0 citations41
US9177834B2Nov 3, 2015
Power bar design for lead frame-based packages
FOONG CHEE SENG0 citations39
NXP USA INC
3 patentsUS11581241B2Feb 14, 2023
Circuit modules with front-side interposer terminals and through-module thermal dissipation structures
NXP USA INC3 citations72
US11056457B2Jul 6, 2021
Semiconductor device with bond wire reinforcement structure
NXP USA INC2 citations72
US9997445B2Jun 12, 2018
Substrate interconnections for packaged semiconductor device
NXP USA INC1 citations47