Inventor · disambiguated record
Ping Liang Tu
Also filed as: TU PING LIANG
3 granted patents·113 citations·filing 2006–2008
72Inventor score
Files withASM ASSEMBLY AUTOMATION LTD3
Top patents by PatentIndex Score
3 records- 0192US7854365B2Direct die attach utilizing heated bond headASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Dec 21, 2010·102 cites·14 claims
- 0279US7648901B2Manufacturing process and apparatus therefor utilizing reducing gasASM ASSEMBLY AUTOMATION LTD·Filed 2006·Granted Jan 19, 2010·6 cites·12 claims
- 0366US8012866B2Method of bonding semiconductor devices utilizing solder ballsASM ASSEMBLY AUTOMATION LTD·Filed 2008·Granted Sep 6, 2011·5 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →