Inventor

CORISIS DAVID J

US307 patents

⚠️ This page may combine multiple inventors who share the name “CORISIS DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CORISIS DAVID J

MICRON TECHNOLOGY INC

Stacked mass storage flash memory package

Stacked mass storage flash memory package

Stacked microelectronic dies and methods for stacking microelectronic dies

Semiconductor card and method of fabrication

Module assembly for stacked BGA packages with a common bus bar in the assembly

Packages for semiconductor die

IC package with dual heat spreaders

Chip scale package with heat spreader and method of manufacture

Lead frame including angle iron tie bar

Stackable ceramic FBGA for high thermal applications

Heat sink with alignment and retaining features

Apparatus and methods of packaging and testing die

Lead frame assemblies with voltage reference plane and IC packages including same

Leads under chip in conventional IC package

Semiconductor package having downset leadframe for reducing package bow

Transverse hybrid LOC package

Semiconductor package having downset leadframe for reducing package bow

Semiconductor package

Method of making chip scale package with heat spreade

Transverse hybrid LOC package

High speed IC package configuration

Leads under chip IC package

High speed IC package configuration

Modular die sockets with flexible interconnects for packaging bare semiconductor die

Stackable ball grid array package

Leads under chip in conventional IC package

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Metal core foldover package structures

Stackable ball grid array

Packaged microelectronic devices and methods for assembling microelectronic devices

Module assembly for stacked BGA packages

Ball array layout

Integrated circuit package including lead frame with electrically isolated alignment feature

Controlling packaging encapsulant leakage

Multi-part lead frame with dissimilar materials and method of manufacturing

Multi-part lead frame with dissimilar materials and method of manufacturing

Integrated circuit package alignment feature

Method of forming a semiconductor device

Stacked microelectronic dies

Method of fabricating a tape having apertures under a lead frame for conventional IC packages

Packaged microelectronic devices and methods for assembling microelectronic devices

Module assembly for stacked BGA packages

Heat sink with alignment and retaining features

Stackable ceramic fbga for high thermal applications

Apparatus and methods of packaging and testing die

CORISIS DAVID J

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

MICRON TECHNOLOGIES INC

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

LEE CHOON KUAN

Packaged microelectronic devices and associated systems