P

Inventor

DING JIAN

CN152 patents
⚠️ This page may combine multiple inventors who share the name “DING JIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

19 patents
US7682518B2Mar 23, 2010

Process for etching a metal layer suitable for use in photomask fabrication

APPLIED MATERIALS INC183 citations98
US6211092B1Apr 3, 2001

Counterbore dielectric plasma etch process particularly useful for dual damascene

APPLIED MATERIALS INC132 citations98
US6074959AJun 13, 2000

Method manifesting a wide process window and using hexafluoropropane or other hydrofluoropropanes to selectively etch oxide

APPLIED MATERIALS INC123 citations98
US6284149B1Sep 4, 2001

High-density plasma etching of carbon-based low-k materials in a integrated circuit

APPLIED MATERIALS INC513 citations97
US6238588B1May 29, 2001

High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process

APPLIED MATERIALS INC84 citations97
US6168726B1Jan 2, 2001

Etching an oxidized organo-silane film

APPLIED MATERIALS INC107 citations97
US6380096B2Apr 30, 2002

In-situ integrated oxide etch process particularly useful for copper dual damascene

APPLIED MATERIALS INC96 citations96
US6183655B1Feb 6, 2001

Tunable process for selectively etching oxide using fluoropropylene and a hydrofluorocarbon

APPLIED MATERIALS INC52 citations96
US5583737ADec 10, 1996

Electrostatic chuck usable in high density plasma

APPLIED MATERIALS INC57 citations96
US5560780AOct 1, 1996

Protective coating for dielectric material on wafer support used in integrated circuit processing apparatus and method of forming same

APPLIED MATERIALS INC57 citations96
US5491603AFeb 13, 1996

Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer

APPLIED MATERIALS INC77 citations96
US6399511B2Jun 4, 2002

Plasma etch process in a single inter-level dielectric etch

APPLIED MATERIALS INC49 citations95
US5539609AJul 23, 1996

Electrostatic chuck usable in high density plasma

APPLIED MATERIALS INC60 citations95
US7250309B2Jul 31, 2007

Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control

APPLIED MATERIALS INC39 citations92
US5965035AOct 12, 1999

Self aligned contact etch using difluoromethane and trifluoromethane

APPLIED MATERIALS INC46 citations92
US6329292B1Dec 11, 2001

Integrated self aligned contact etch

APPLIED MATERIALS INC25 citations88
US7521000B2Apr 21, 2009

Process for etching photomasks

APPLIED MATERIALS INC6 citations72
US7365014B2Apr 29, 2008

Reticle fabrication using a removable hard mask

APPLIED MATERIALS INC7 citations72
US6361705B1Mar 26, 2002

Plasma process for selectively etching oxide using fluoropropane or fluoropropylene

APPLIED MATERIALS INC7 citations72

CITRIX SYSTEMS INC

10 patents

CA NAT RESEARCH COUNCIL

2 patents

ADAMS CHRISTOPHER MICHAEL

2 patents

(unassigned)

2 patents

ZHU MEGAN

2 patents

INTER CITIC MINERAL TECHNOLOGI

2 patents

SHANGHAI INST MATERIA MEDICA CAS

2 patents

NAN FAJUN

1 patent

CHANDRACHOOD MADHAVI R

1 patent

INTER CITIC ENVIROTEC INC

1 patent

DING JIAN

1 patent

LOMAS LEE O

1 patent

ADIR

1 patent

HUAWEI TECH CO LTD

1 patent

MICROSOFT TECHNOLOGY LICENSING LLC

1 patent

SHANGHAI INST MATERIA MEDICA

1 patent

Showing the top 50 of 152 patents by PatentIndex Score.