Inventor
PERINO DONALD V
US45 patents
⚠️ This page may combine multiple inventors who share the name “PERINO DONALD V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAMBUS INC
41 patentsUS6621155B1Sep 16, 2003
Integrated circuit device having stacked dies and impedance balanced transmission lines
RAMBUS INC316 citations99
US6545875B1Apr 8, 2003
Multiple channel modules and bus systems using same
RAMBUS INC75 citations99
US6504875B2Jan 7, 2003
Apparatus for multilevel signaling
RAMBUS INC157 citations99
US6376904B1Apr 23, 2002
Redistributed bond pads in stacked integrated circuit die package
RAMBUS INC339 citations99
US6359931B1Mar 19, 2002
Apparatus and method for multilevel signaling
RAMBUS INC253 citations99
US6266730B1Jul 24, 2001
High-frequency bus system
RAMBUS INC137 citations99
US6234820B1May 22, 2001
Method and apparatus for joining printed circuit boards
RAMBUS INC193 citations99
US6067594AMay 23, 2000
High frequency bus system
RAMBUS INC125 citations99
US6007357ADec 28, 1999
Chip socket assembly and chip file assembly for semiconductor chips
RAMBUS INC113 citations99
US6005895ADec 21, 1999
Apparatus and method for multilevel signaling
RAMBUS INC267 citations99
US7130944B2Oct 31, 2006
Chip-to-chip communication system using an ac-coupled bus and devices employed in same
RAMBUS INC77 citations98
US6854030B2Feb 8, 2005
Integrated circuit device having a capacitive coupling element
RAMBUS INC95 citations98
US6687319B1Feb 3, 2004
Spread spectrum clocking of digital signals
RAMBUS INC82 citations98
US6657468B1Dec 2, 2003
Apparatus and method for controlling edge rates of digital signals
RAMBUS INC78 citations98
US6530062B1Mar 4, 2003
Active impedance compensation
RAMBUS INC109 citations98
US6514794B2Feb 4, 2003
Redistributed bond pads in stacked integrated circuit die package
RAMBUS INC108 citations98
US6496889B1Dec 17, 2002
Chip-to-chip communication system using an ac-coupled bus and devices employed in same
RAMBUS INC81 citations98
US6426984B1Jul 30, 2002
Apparatus and method for reducing clock signal phase skew in a master-slave system with multiple latent clock cycles
RAMBUS INC82 citations98
US6002589ADec 14, 1999
Integrated circuit package for coupling to a printed circuit board
RAMBUS INC106 citations98
US5995016ANov 30, 1999
Method and apparatus for N choose M device selection
RAMBUS INC100 citations98
US7099424B1Aug 29, 2006
Clock data recovery with selectable phase control
RAMBUS INC118 citations97
US6687780B1Feb 3, 2004
Expandable slave device system
RAMBUS INC47 citations96
US6657871B2Dec 2, 2003
Multiple channel modules and bus systems using same
RAMBUS INC53 citations96
US6619973B2Sep 16, 2003
Chip socket assembly and chip file assembly for semiconductor chips
RAMBUS INC70 citations96
US6404660B1Jun 11, 2002
Semiconductor package with a controlled impedance bus and method of forming same
RAMBUS INC50 citations95
US6273759B1Aug 14, 2001
Multi-slot connector with integrated bus providing contact between adjacent modules
RAMBUS INC59 citations95
US6968024B1Nov 22, 2005
Apparatus and method for operating a master-slave system with a clock signal and a separate phase signal
RAMBUS INC20 citations93
US6589059B2Jul 8, 2003
Chip socket assembly and chip file assembly for semiconductor chips
RAMBUS INC15 citations93
US6447321B1Sep 10, 2002
Socket for coupling an integrated circuit package to a printed circuit board
RAMBUS INC28 citations93
US6621373B1Sep 16, 2003
Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital system
RAMBUS INC42 citations92
US7627043B2Dec 1, 2009
Method and apparatus for transmitting data with reduced coupling noise
RAMBUS INC13 citations84
US6352435B1Mar 5, 2002
Chip socket assembly and chip file assembly for semiconductor chips
RAMBUS INC12 citations82
US7134101B2Nov 7, 2006
Active impedance compensation
RAMBUS INC5 citations74
US7626248B2Dec 1, 2009
Semiconductor package with a controlled impedance bus
RAMBUS INC5 citations73
US7222209B2May 22, 2007
Expandable slave device system
RAMBUS INC6 citations73
US6714431B2Mar 30, 2004
Semiconductor package with a controlled impedance bus and method of forming same
RAMBUS INC7 citations73
USRE39153EJul 4, 2006
Connector with integral transmission line bus
RAMBUS INC6 citations70
US7536494B2May 19, 2009
Expandable slave device system with buffered subsystems
RAMBUS INC4 citations62
US6999332B2Feb 14, 2006
Semiconductor package with a controlled impedance bus and method of forming same
RAMBUS INC2 citations62
US8036284B2Oct 11, 2011
Method and apparatus for transmitting data with reduced coupling noise
RAMBUS INC1 citations52
US6583035B2Jun 24, 2003
Semiconductor package with a controlled impedance bus and method of forming same
RAMBUS INC0 citations51