Inventor

WARK JAMES M

US172 patents

Patents

50 patents

US7498675B2Mar 3, 2009

Semiconductor component having plate, stacked dice and conductive vias

MICRON TECHNOLOGY INC292 citations99

US7060526B2Jun 13, 2006

Wafer level methods for fabricating multi-dice chip scale semiconductor components

MICRON TECHNOLOGY INC96 citations99

US6841868B2Jan 11, 2005

Memory modules including capacity for additional memory

MICRON TECHNOLOGY INC83 citations99

US6841883B1Jan 11, 2005

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

MICRON TECHNOLOGY INC659 citations99

US6613662B2Sep 2, 2003

Method for making projected contact structures for engaging bumped semiconductor devices

MICRON TECHNOLOGY INC128 citations99

US6252308B1Jun 26, 2001

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

MICRON TECHNOLOGY INC255 citations99

US5952840ASep 14, 1999

Apparatus for testing semiconductor wafers

MICRON TECHNOLOGY INC128 citations99

US5931685AAug 3, 1999

Interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC158 citations99

US5929521AJul 27, 1999

Projected contact structure for bumped semiconductor device and resulting articles and assemblies

MICRON TECHNOLOGY INC179 citations99

US5915977AJun 29, 1999

System and interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC164 citations99

US5893726AApr 13, 1999

Semiconductor package with pre-fabricated cover and method of fabrication

MICRON TECHNOLOGY INC174 citations99

US5866953AFeb 2, 1999

Packaged die on PCB with heat sink encapsulant

MICRON TECHNOLOGY INC290 citations99

US5817540AOct 6, 1998

Method of fabricating flip-chip on leads devices and resulting assemblies

MICRON TECHNOLOGY INC262 citations99

US5766982AJun 16, 1998

Method and apparatus for underfill of bumped or raised die

MICRON TECHNOLOGY INC114 citations99

US5696031ADec 9, 1997

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

MICRON TECHNOLOGY INC196 citations99

US7683458B2Mar 23, 2010

Through-wafer interconnects for photoimager and memory wafers

MICRON TECHNOLOGY INC54 citations98

US7459393B2Dec 2, 2008

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

MICRON TECHNOLOGY INC58 citations98

US6998717B2Feb 14, 2006

Multi-dice chip scale semiconductor components

MICRON TECHNOLOGY INC64 citations98

US6342724B1Jan 29, 2002

Thin film capacitor coupons for memory modules and multi-chip modules

MICRON TECHNOLOGY INC80 citations98

US6072323AJun 6, 2000

Temporary package, and method system for testing semiconductor dice having backside electrodes

MICRON TECHNOLOGY INC97 citations98

US6057597AMay 2, 2000

Semiconductor package with pre-fabricated cover

MICRON TECHNOLOGY INC107 citations98

US5894218AApr 13, 1999

Method and apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC137 citations98

US6140149AOct 31, 2000

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

MICRON TECHNOLOGY INC55 citations97

US5807762ASep 15, 1998

Multi-chip module system and method of fabrication

MICRON TECHNOLOGY INC83 citations97

US7224051B2May 29, 2007

Semiconductor component having plate and stacked dice

MICRON TECHNOLOGY INC34 citations96

US7115495B2Oct 3, 2006

Methods of making projected contact structures for engaging bumped semiconductor devices

MICRON TECHNOLOGY INC39 citations96

US6900459B2May 31, 2005

Apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC28 citations96

US6720652B2Apr 13, 2004

Apparatus providing redundancy for fabricating highly reliable memory modules

MICRON TECHNOLOGY INC45 citations96

US6605489B2Aug 12, 2003

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

MICRON TECHNOLOGY INC21 citations96

US6605956B2Aug 12, 2003

Device and method for testing integrated circuit dice in an integrated circuit module

MICRON TECHNOLOGY INC70 citations96

US6600334B1Jul 29, 2003

Force applying probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC43 citations96

US6553276B2Apr 22, 2003

Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC48 citations96

US6531772B2Mar 11, 2003

Electronic system including memory module with redundant memory capability

MICRON TECHNOLOGY INC62 citations96

US6420892B1Jul 16, 2002

Calibration target for calibrating semiconductor wafer test systems

MICRON TECHNOLOGY INC62 citations96

US6399416B1Jun 4, 2002

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

MICRON TECHNOLOGY INC40 citations96

US6395565B1May 28, 2002

Multi-chip module system and method of fabrication

MICRON TECHNOLOGY INC38 citations96

US6362637B2Mar 26, 2002

Apparatus for testing semiconductor wafers including base with contact members and terminal contacts

MICRON TECHNOLOGY INC61 citations96

US6363295B1Mar 26, 2002

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC64 citations96

US6295978B1Oct 2, 2001

Method for reducing damage to wafer cutting blades during wafer dicing

MICRON TECHNOLOGY INC38 citations96

US6291897B1Sep 18, 2001

Carriers including projected contact structures for engaging bumped semiconductor devices

MICRON TECHNOLOGY INC44 citations96

US6239590B1May 29, 2001

Calibration target for calibrating semiconductor wafer test systems

MICRON TECHNOLOGY INC70 citations96

US6240535B1May 29, 2001

Device and method for testing integrated circuit dice in an integrated circuit module

MICRON TECHNOLOGY INC40 citations96

US6215181B1Apr 10, 2001

Method and apparatus providing redundancy for fabricating highly reliable memory modules

MICRON TECHNOLOGY INC41 citations96

US6112740ASep 5, 2000

Method for reducing damage to wafer cutting blades during wafer dicing

MICRON TECHNOLOGY INC25 citations96

Showing the top 50 of 172 patents by PatentIndex Score.

WARK JAMES M

Patents

Semiconductor component having plate, stacked dice and conductive vias

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Memory modules including capacity for additional memory

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Method for making projected contact structures for engaging bumped semiconductor devices

Packaged die PCB with heat sink encapsulant

Thin film capacitor coupons for memory modules and multi-chip modules

Force applying probe card and test system for semiconductor wafers

Flip-chip on leads devices

Direct connect interconnect for testing semiconductor dice and wafers

Thin film capacitor coupons for memory modules and multi-chip modules

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus for testing semiconductor wafers

Interconnect for making temporary electrical connections with bumped semiconductor components

Projected contact structure for bumped semiconductor device and resulting articles and assemblies

System and interconnect for making temporary electrical connections with bumped semiconductor components

Semiconductor package with pre-fabricated cover and method of fabrication

Packaged die on PCB with heat sink encapsulant

Method of fabricating flip-chip on leads devices and resulting assemblies

Method and apparatus for underfill of bumped or raised die

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Through-wafer interconnects for photoimager and memory wafers

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Multi-dice chip scale semiconductor components

Thin film capacitor coupons for memory modules and multi-chip modules

Temporary package, and method system for testing semiconductor dice having backside electrodes

Semiconductor package with pre-fabricated cover

Method and apparatus for automatically positioning electronic dice within component packages

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Multi-chip module system and method of fabrication

Semiconductor component having plate and stacked dice

Methods of making projected contact structures for engaging bumped semiconductor devices

Apparatus for automatically positioning electronic dice within component packages

Apparatus providing redundancy for fabricating highly reliable memory modules

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Device and method for testing integrated circuit dice in an integrated circuit module

Force applying probe card and test system for semiconductor wafers

Method of using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Electronic system including memory module with redundant memory capability

Calibration target for calibrating semiconductor wafer test systems

Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Multi-chip module system and method of fabrication

Apparatus for testing semiconductor wafers including base with contact members and terminal contacts

Method for using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Method for reducing damage to wafer cutting blades during wafer dicing

Carriers including projected contact structures for engaging bumped semiconductor devices

Calibration target for calibrating semiconductor wafer test systems

Device and method for testing integrated circuit dice in an integrated circuit module

Method and apparatus providing redundancy for fabricating highly reliable memory modules

Method for reducing damage to wafer cutting blades during wafer dicing

Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs