Inventor

OFNER GERALD

DE45 patents

⚠️ This page may combine multiple inventors who share the name “OFNER GERALD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OFNER GERALD

INFINEON TECHNOLOGIES AG

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

Electronic component and semiconductor wafer, and method for producing the same

Electronic component with a plastic package and method for production

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

Electronic component and process for producing the electronic component

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Electronic component with shielding and method for its production

Semiconductor package and method for producing the same

Semiconductor package with contact support layer and method to produce the package

Magnetically alignable integrated circuit device

Multi-purpose non-linear semiconductor package assembly line

Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Semiconductor package and method for producing the same

Electronic component with at least one semiconductor chip and method for its manufacture

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Package with vertical interconnect between carrier and clip

INTEL IP CORP

Package-on-package stacked microelectronic structures

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Hybrid exposure for semiconductor devices

Stress buffer layer for integrated microelectromechanical systems (MEMS)

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Flexible band wearable electronic device

MEYER THORSTEN

Stacked fan-out semiconductor chip

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Enhanced flip chip package

Repairable semiconductor device and method

Repairable semiconductor device and method

INTEL CORP

Microelectronic package having a passive microelectronic device disposed within a package body

Passive electrical devices with a polymer carrier

Integrated circuit package

Microelectronic package having a passive microelectronic device disposed within a package body

Integrated circuit package

INTEL MOBILE COMM GMBH

Enhanced flip chip package

Chip arrangement and method for manufacturing a chip arrangement

Chip interposer, semiconductor device, and method for manufacturing a semiconductor device

INTEL DEUTSCHLAND GMBH

Semiconductor devices

GEISSLER CHRISTIAN

Stress buffer layer for integrated microelectromechanical systems (MEMS)

GANESAN SANKA

Integrated circuit packages

INFINENON TECHNOLOGIES AG

Integrated circuit package and a method for forming an integrated circuit package

SIEMENS AG

Biosensor with smart card configuration

CHAN KAI CHONG

Semiconductor device for radio frequency applications and method for making the same