Inventor · disambiguated record
Thomas H. Shilling
Also filed as: SHILLING THOMAS H · SHILLING THOMAS HERBERT
13 granted patents·2 pending applications·101 citations·filing 2000–2011
90Inventor score
Top patents by PatentIndex Score
15 records- 0190US7224047B2Semiconductor device package with reduced leakageLSI CORP·Filed 2004·Granted May 29, 2007·62 cites·20 claims
- 0278US7982307B2Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrateAGERE SYSTEMS INC·Filed 2006·Granted Jul 19, 2011·9 cites·20 claims
- 0374US8228679B2Connections for electronic devices on double-sided circuit boardSHILLING THOMAS H·Filed 2008·Granted Jul 24, 2012·8 cites·15 claims
- 0474US7433192B2Packaging for electronic modulesAGERE SYSTEMS INC·Filed 2005·Granted Oct 7, 2008·7 cites·5 claims
- 0572US7541669B2Semiconductor device package with base features to reduce leakageAGERE SYSTEMS INC·Filed 2007·Granted Jun 2, 2009·5 cites·16 claims
- 0670US8133799B2Controlling warping in integrated circuit devicesOSENBACH JOHN W·Filed 2011·Granted Mar 13, 2012·2 cites·12 claims
- 0761US7598602B2Controlling warping in integrated circuit devicesAGERE SYSTEMS INC·Filed 2008·Granted Oct 6, 2009·1 cites·2 claims
- 0861US7408246B2Controlling warping in integrated circuit devicesAGERE SYSTEMS INC·Filed 2005·Granted Aug 5, 2008·1 cites·16 claims
- 0956US6621280B1Method of testing an integrated circuitAGERE SYSTEMS INC·Filed 2000·Granted Sep 16, 2003·5 cites·10 claims
- 1055US7923347B2Controlling warping in integrated circuit devicesAGERE SYSTEMS INC·Filed 2009·Granted Apr 12, 2011·0 cites·12 claims
- 1152US2008041620A1Surface mount attachment of componentsALBANESE PATRICIA M·Filed 2007·Application pending·0 cites
- 1246US6833557B1Integrated circuit and a method of manufacturing an integrated circuitAGERE SYSTEMS INC·Filed 2000·Granted Dec 21, 2004·1 cites·11 claims
- 1341US2005247761A1Surface mount attachment of componentsALBANESE PATRICIA M·Filed 2004·Application pending·0 cites
- 1440US7242090B2Device packageAGERE SYSTEMS INC·Filed 2005·Granted Jul 10, 2007·0 cites·20 claims
- 1535US6890445B2Process for packaging electronic devices using thin bonding regionsAGERE SYSTEMS INC·Filed 2001·Granted May 10, 2005·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →