Inventor
BASCERI CEM
US288 patents
⚠️ This page may combine multiple inventors who share the name “BASCERI CEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
47 patentsUS7422635B2Sep 9, 2008
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
MICRON TECHNOLOGY INC483 citations99
US7217617B2May 15, 2007
Methods of forming a capacitor
MICRON TECHNOLOGY INC418 citations99
US7052584B2May 30, 2006
Method of forming a capacitor
MICRON TECHNOLOGY INC421 citations99
US6890596B2May 10, 2005
Deposition methods
MICRON TECHNOLOGY INC418 citations99
US6884475B2Apr 26, 2005
Chemical vapor deposition method for depositing a high k dielectric film
MICRON TECHNOLOGY INC426 citations99
US6753618B2Jun 22, 2004
MIM capacitor with metal nitride electrode materials and method of formation
MICRON TECHNOLOGY INC132 citations99
US6558517B2May 6, 2003
Physical vapor deposition methods
MICRON TECHNOLOGY INC437 citations99
US6534357B1Mar 18, 2003
Methods for forming conductive structures and structures regarding same
MICRON TECHNOLOGY INC95 citations99
US6335049B1Jan 1, 2002
Chemical vapor deposition methods of forming a high K dielectric layer and methods of forming a capacitor
MICRON TECHNOLOGY INC501 citations99
US6281142B1Aug 28, 2001
Dielectric cure for reducing oxygen vacancies
MICRON TECHNOLOGY INC124 citations99
US7320911B2Jan 22, 2008
Methods of forming pluralities of capacitors
MICRON TECHNOLOGY INC82 citations98
US7273791B2Sep 25, 2007
Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer
MICRON TECHNOLOGY INC61 citations98
US7208198B2Apr 24, 2007
Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer
MICRON TECHNOLOGY INC419 citations98
US6982103B2Jan 3, 2006
Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer
MICRON TECHNOLOGY INC424 citations98
US6884296B2Apr 26, 2005
Reactors having gas distributors and methods for depositing materials onto micro-device workpieces
MICRON TECHNOLOGY INC80 citations98
US6838122B2Jan 4, 2005
Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers
MICRON TECHNOLOGY INC429 citations98
US6566147B2May 20, 2003
Method for controlling deposition of dielectric films
MICRON TECHNOLOGY INC98 citations98
US6673701B1Jan 6, 2004
Atomic layer deposition methods
MICRON TECHNOLOGY INC223 citations97
US6596583B2Jul 22, 2003
Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers
MICRON TECHNOLOGY INC96 citations97
US7271077B2Sep 18, 2007
Deposition methods with time spaced and time abutting precursor pulses
MICRON TECHNOLOGY INC82 citations96
US6939723B2Sep 6, 2005
Method of forming haze-free BST films
MICRON TECHNOLOGY INC28 citations96
US6785120B1Aug 31, 2004
Methods of forming hafnium-containing materials, methods of forming hafnium oxide, and capacitor constructions comprising hafnium oxide
MICRON TECHNOLOGY INC33 citations96
US6780766B2Aug 24, 2004
Methods of forming regions of differing composition over a substrate
MICRON TECHNOLOGY INC46 citations96
US6753271B2Jun 22, 2004
Atomic layer deposition methods
MICRON TECHNOLOGY INC40 citations96
US6682969B1Jan 27, 2004
Top electrode in a strongly oxidizing environment
MICRON TECHNOLOGY INC61 citations96
US6617250B2Sep 9, 2003
Methods of depositing a layer comprising tungsten and methods of forming a transistor gate line
MICRON TECHNOLOGY INC38 citations96
US6511912B1Jan 28, 2003
Method of forming a non-conformal layer over and exposing a trench
MICRON TECHNOLOGY INC56 citations96
US6511896B2Jan 28, 2003
Method of etching a substantially amorphous TA2O5 comprising layer
MICRON TECHNOLOGY INC48 citations96
US6492241B1Dec 10, 2002
Integrated capacitors fabricated with conductive metal oxides
MICRON TECHNOLOGY INC64 citations96
US6476432B1Nov 5, 2002
Structures and methods for enhancing capacitors in integrated circuits
MICRON TECHNOLOGY INC55 citations96
US7767525B2Aug 3, 2010
Methods of forming vertical transistor structures
MICRON TECHNOLOGY INC21 citations93
US7311942B2Dec 25, 2007
Method for binding halide-based contaminants during formation of a titanium-based film
MICRON TECHNOLOGY INC11 citations93
US7268034B2Sep 11, 2007
Methods of forming pluralities of capacitors, and integrated circuitry
MICRON TECHNOLOGY INC30 citations93
US7164165B2Jan 16, 2007
MIS capacitor
MICRON TECHNOLOGY INC15 citations93
US7033884B2Apr 25, 2006
Methods of forming capacitor constructions
MICRON TECHNOLOGY INC26 citations93
US7029985B2Apr 18, 2006
Method of forming MIS capacitor
MICRON TECHNOLOGY INC28 citations93
US7026243B2Apr 11, 2006
Methods of forming conductive material silicides by reaction of metal with silicon
MICRON TECHNOLOGY INC17 citations93
US7011978B2Mar 14, 2006
Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions
MICRON TECHNOLOGY INC15 citations93
US6969677B2Nov 29, 2005
Methods of forming conductive metal silicides by reaction of metal with silicon
MICRON TECHNOLOGY INC20 citations93
US6962824B2Nov 8, 2005
Method for controlling deposition of dielectric films
MICRON TECHNOLOGY INC21 citations93
US6917112B2Jul 12, 2005
Conductive semiconductor structures containing metal oxide regions
MICRON TECHNOLOGY INC26 citations93
US6908639B2Jun 21, 2005
Mixed composition interface layer and method of forming
MICRON TECHNOLOGY INC22 citations93
US6887521B2May 3, 2005
Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices
MICRON TECHNOLOGY INC30 citations93
US6881642B2Apr 19, 2005
Method of forming a MIM capacitor with metal nitride electrode
MICRON TECHNOLOGY INC37 citations93
US6878602B2Apr 12, 2005
Dielectric cure for reducing oxygen vacancies
MICRON TECHNOLOGY INC18 citations93
US6861330B2Mar 1, 2005
Structures and methods for enhancing capacitors in integrated circuits
MICRON TECHNOLOGY INC26 citations93
US6838293B2Jan 4, 2005
Method for controlling deposition of dielectric films
MICRON TECHNOLOGY INC22 citations93
CREE INC
3 patentsUS7364988B2Apr 29, 2008
Method of manufacturing gallium nitride based high-electron mobility devices
CREE INC87 citations98
US7326971B2Feb 5, 2008
Gallium nitride based high-electron mobility devices
CREE INC93 citations98
US7355223B2Apr 8, 2008
Vertical junction field effect transistor having an epitaxial gate
CREE INC26 citations93
Showing the top 50 of 288 patents by PatentIndex Score.