P

Inventor

BASCERI CEM

US288 patents
⚠️ This page may combine multiple inventors who share the name “BASCERI CEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

47 patents
US7422635B2Sep 9, 2008

Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

MICRON TECHNOLOGY INC483 citations99
US7217617B2May 15, 2007

Methods of forming a capacitor

MICRON TECHNOLOGY INC418 citations99
US7052584B2May 30, 2006

Method of forming a capacitor

MICRON TECHNOLOGY INC421 citations99
US6890596B2May 10, 2005

Deposition methods

MICRON TECHNOLOGY INC418 citations99
US6884475B2Apr 26, 2005

Chemical vapor deposition method for depositing a high k dielectric film

MICRON TECHNOLOGY INC426 citations99
US6753618B2Jun 22, 2004

MIM capacitor with metal nitride electrode materials and method of formation

MICRON TECHNOLOGY INC132 citations99
US6558517B2May 6, 2003

Physical vapor deposition methods

MICRON TECHNOLOGY INC437 citations99
US6534357B1Mar 18, 2003

Methods for forming conductive structures and structures regarding same

MICRON TECHNOLOGY INC95 citations99
US6335049B1Jan 1, 2002

Chemical vapor deposition methods of forming a high K dielectric layer and methods of forming a capacitor

MICRON TECHNOLOGY INC501 citations99
US6281142B1Aug 28, 2001

Dielectric cure for reducing oxygen vacancies

MICRON TECHNOLOGY INC124 citations99
US7320911B2Jan 22, 2008

Methods of forming pluralities of capacitors

MICRON TECHNOLOGY INC82 citations98
US7273791B2Sep 25, 2007

Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer

MICRON TECHNOLOGY INC61 citations98
US7208198B2Apr 24, 2007

Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer

MICRON TECHNOLOGY INC419 citations98
US6982103B2Jan 3, 2006

Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer

MICRON TECHNOLOGY INC424 citations98
US6884296B2Apr 26, 2005

Reactors having gas distributors and methods for depositing materials onto micro-device workpieces

MICRON TECHNOLOGY INC80 citations98
US6838122B2Jan 4, 2005

Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers

MICRON TECHNOLOGY INC429 citations98
US6566147B2May 20, 2003

Method for controlling deposition of dielectric films

MICRON TECHNOLOGY INC98 citations98
US6673701B1Jan 6, 2004

Atomic layer deposition methods

MICRON TECHNOLOGY INC223 citations97
US6596583B2Jul 22, 2003

Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers

MICRON TECHNOLOGY INC96 citations97
US7271077B2Sep 18, 2007

Deposition methods with time spaced and time abutting precursor pulses

MICRON TECHNOLOGY INC82 citations96
US6939723B2Sep 6, 2005

Method of forming haze-free BST films

MICRON TECHNOLOGY INC28 citations96
US6785120B1Aug 31, 2004

Methods of forming hafnium-containing materials, methods of forming hafnium oxide, and capacitor constructions comprising hafnium oxide

MICRON TECHNOLOGY INC33 citations96
US6780766B2Aug 24, 2004

Methods of forming regions of differing composition over a substrate

MICRON TECHNOLOGY INC46 citations96
US6753271B2Jun 22, 2004

Atomic layer deposition methods

MICRON TECHNOLOGY INC40 citations96
US6682969B1Jan 27, 2004

Top electrode in a strongly oxidizing environment

MICRON TECHNOLOGY INC61 citations96
US6617250B2Sep 9, 2003

Methods of depositing a layer comprising tungsten and methods of forming a transistor gate line

MICRON TECHNOLOGY INC38 citations96
US6511912B1Jan 28, 2003

Method of forming a non-conformal layer over and exposing a trench

MICRON TECHNOLOGY INC56 citations96
US6511896B2Jan 28, 2003

Method of etching a substantially amorphous TA2O5 comprising layer

MICRON TECHNOLOGY INC48 citations96
US6492241B1Dec 10, 2002

Integrated capacitors fabricated with conductive metal oxides

MICRON TECHNOLOGY INC64 citations96
US6476432B1Nov 5, 2002

Structures and methods for enhancing capacitors in integrated circuits

MICRON TECHNOLOGY INC55 citations96
US7767525B2Aug 3, 2010

Methods of forming vertical transistor structures

MICRON TECHNOLOGY INC21 citations93
US7311942B2Dec 25, 2007

Method for binding halide-based contaminants during formation of a titanium-based film

MICRON TECHNOLOGY INC11 citations93
US7268034B2Sep 11, 2007

Methods of forming pluralities of capacitors, and integrated circuitry

MICRON TECHNOLOGY INC30 citations93
US7164165B2Jan 16, 2007

MIS capacitor

MICRON TECHNOLOGY INC15 citations93
US7033884B2Apr 25, 2006

Methods of forming capacitor constructions

MICRON TECHNOLOGY INC26 citations93
US7029985B2Apr 18, 2006

Method of forming MIS capacitor

MICRON TECHNOLOGY INC28 citations93
US7026243B2Apr 11, 2006

Methods of forming conductive material silicides by reaction of metal with silicon

MICRON TECHNOLOGY INC17 citations93
US7011978B2Mar 14, 2006

Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions

MICRON TECHNOLOGY INC15 citations93
US6969677B2Nov 29, 2005

Methods of forming conductive metal silicides by reaction of metal with silicon

MICRON TECHNOLOGY INC20 citations93
US6962824B2Nov 8, 2005

Method for controlling deposition of dielectric films

MICRON TECHNOLOGY INC21 citations93
US6917112B2Jul 12, 2005

Conductive semiconductor structures containing metal oxide regions

MICRON TECHNOLOGY INC26 citations93
US6908639B2Jun 21, 2005

Mixed composition interface layer and method of forming

MICRON TECHNOLOGY INC22 citations93
US6887521B2May 3, 2005

Gas delivery system for pulsed-type deposition processes used in the manufacturing of micro-devices

MICRON TECHNOLOGY INC30 citations93
US6881642B2Apr 19, 2005

Method of forming a MIM capacitor with metal nitride electrode

MICRON TECHNOLOGY INC37 citations93
US6878602B2Apr 12, 2005

Dielectric cure for reducing oxygen vacancies

MICRON TECHNOLOGY INC18 citations93
US6861330B2Mar 1, 2005

Structures and methods for enhancing capacitors in integrated circuits

MICRON TECHNOLOGY INC26 citations93
US6838293B2Jan 4, 2005

Method for controlling deposition of dielectric films

MICRON TECHNOLOGY INC22 citations93

CREE INC

3 patents

Showing the top 50 of 288 patents by PatentIndex Score.