Inventor

WEIDNER KARL

DE50 patents

⚠️ This page may combine multiple inventors who share the name “WEIDNER KARL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WEIDNER KARL

OSRAM OPTO SEMICONDUCTORS GMBH

Optoelectronic semiconductor component

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

Method for the production of a semiconductor component comprising a planar contact, and semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

Optoelectronic semiconductor component

Optoelectronic semiconductor component

Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stress

SIEMENS AG

Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Method of manufacturing self-supporting contacting structures

Arrangement for hermetically sealing components, and method for the production thereof

Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces

Method of manufacturing a device having a contacting structure

Method for transforming a substrate with edge contacts into a ball grid array

Metallised film for sheet contacting

Device having a contacting structure

Electrical component on a substrate and method for production thereof

Arrangement of an electrical component placed on a substrate, and method for producing the same

Power module having power device connected between heat sink and drive unit

WEIDNER KARL

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

Radiation-emitting component and method for producing radiation-emitting components

Optoelectronic component and method for producing it

Method for producing at least one optoelectronic semiconductor component

Method and apparatus for manufacturing an electronic module, and electronic module

Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof

Producing SiC packs on a wafer plane

EPCOS AG

Surface acoustic wave component

Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like

Micromechanical measuring element and method for producing a micromechanical measuring element

ADOLF WUERTH GMBH & CO KG

Apparatus for storing and delivering sale units

Apparatus for storing and delivering sale units

INFINEON TECHNOLOGIES AG

Method for producing a dielectric layer for an electronic component

BRAUNE BERT

Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components

SNAPTRACK INC

Stacked modules

WEGLEITER WALTER

Optoelectronic component and production method for an optoelectronic component

BARCHMANN BERND

Optoelectronic component and method for producing an opto-electronic component

FLEISCHER MAXIMILIAN

Micromechanical substrate for a diaphragm with a diffusion barrier layer

LUPP FRIEDRICH

Planar electrical power electronic modules for high-temperature applications, and corresponding production methods

HOLST JENS-CHRISTIAN

Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material

PAHL WOLFGANG

System support for electronic components and method for production thereof

BITTMANN LADISLAUS

Method for making contact with a contact surface on a substrate

NAUNDORF JOERG

Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device

KALTENBACHER AXEL

Method for contacting electronic components by means of a substrate plate

KASPAR MICHAEL

Strip conductor structure for minimizing thermomechanical loads