Planar electrical power electronic modules for high-temperature applications, and corresponding production methods

Abstract

With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component ( 1 ) is fastened to an electrically insulating carrier film ( 3 ) having at least one first inorganic material and at least one opening ( 5 ) in which at least one electrical contact-connection ( 7 ) of the component ( 1 ) to outside the component ( 1 ) is provided. This makes it possible to provide electronic components ( 1 ), in particular power modules, for a temperature range of >175 DEG C.

What is claimed is: 
     
       1. An electronic component of a module, wherein the component is attached to an electrically-insulating carrier film comprising at least one first inorganic material, which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided, wherein the at least one first inorganic material comprises exclusively inorganic or multi-bonded inorganic insulation materials. 
     
     
       2. The electronic component according to  claim 1 , further comprising: a fill layer comprising at least one second inorganic material for electrical insulation of the electronic components by means of a high-temperature package, with the fill layer filling spaces between the electronic component, carrier film and a leadframe, wherein the at least one second inorganic material comprises exclusively inorganic or multi-bonded inorganic insulation materials. 
     
     
       3. The electronic component according to  claim 2 , wherein at least one of the first and second inorganic material is a ceramic high-temperature material or a ceramic high-temperature material in an inorganic composite matrix. 
     
     
       4. The electronic component according to  claim 2 , wherein the first and or second inorganic material is at least one of glass, boron nitride, boron carbide, high-temperature cement, silicon nitride, mixed ceramic, aluminum oxide, silicon carbide and a ceramic adhesive. 
     
     
       5. The electronic component according to  claim 2 , wherein the fill layer has a multilayer structure. 
     
     
       6. The electronic component according to  claim 5 , wherein an adhesion agent is embodied between the individual layers to provide effective adhesion between the individual layers. 
     
     
       7. The electronic component according to  claim 2 , wherein a layer is applied to the fill layer for closing and healing the pores and tears of the last layer. 
     
     
       8. The electronic component according to  claim 1 , wherein the electrical contact-connection comprises at least one structured, flat, electrical conductor layer comprising at least one of Cu, Ni/Au, Ag, Sn—Ag in at least one of the opening and to at least one side of the electrically-insulating carrier film. 
     
     
       9. The electronic component according to  claim 8 , wherein the electrical contact-connection comprises, electrical contacting of the conductor layer to at least one leadframe which may consist of copper. 
     
     
       10. The electronic component according to  claim 2 , wherein the fill layer is looped back to the side of the component. 
     
     
       11. The electronic component according to  claim 1 , wherein at least one heat sink is applied to at least one of the electrical contact-connection and to the side of the component facing away from the carrier film. 
     
     
       12. An electronic component of a module including a plurality of insulating materials, wherein the component is attached to an electrically-insulating carrier film which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided,
 a fill layer comprising electrical insulation of the electronic components by means of a high-temperature package, with the fill layer filling spaces between the electronic component, carrier film and a leadframe, 
 wherein the plurality of insulating materials comprise exclusively inorganic or multi-bonded inorganic insulation materials.