Inventor
TSAI SHIANN-TSONG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “TSAI SHIANN-TSONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
14 patentsUS11227846B2Jan 18, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC7 citations84
US9842831B2Dec 12, 2017
Semiconductor package and fabrication method thereof
MEDIATEK INC3 citations72
US11302657B2Apr 12, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC1 citations71
US10037936B2Jul 31, 2018
Semiconductor package with coated bonding wires and fabrication method thereof
MEDIATEK INC2 citations71
US11869849B2Jan 9, 2024
Semiconductor package with EMI shielding structure
MEDIATEK INC0 citations62
US11355450B2Jun 7, 2022
Semiconductor package with EMI shielding structure
MEDIATEK INC0 citations62
US11257780B2Feb 22, 2022
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
MEDIATEK INC0 citations62
US10847488B2Nov 24, 2020
Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
MEDIATEK INC1 citations62
US10276465B2Apr 30, 2019
Semiconductor package assembly
MEDIATEK INC1 citations62
US11967570B2Apr 23, 2024
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US11705413B2Jul 18, 2023
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US10685943B2Jun 16, 2020
Semiconductor chip package with resilient conductive paste post and fabrication method thereof
MEDIATEK INC0 citations51
US10340259B2Jul 2, 2019
Method for fabricating a semiconductor package
MEDIATEK INC0 citations51
US10008441B2Jun 26, 2018
Semiconductor package
MEDIATEK INC0 citations41
ULTRATERA CORP
3 patentsUS7091623B2Aug 15, 2006
Multi-chip semiconductor package and fabrication method thereof
ULTRATERA CORP22 citations89
US6879030B2Apr 12, 2005
Strengthened window-type semiconductor package
ULTRATERA CORP9 citations71
US6825064B2Nov 30, 2004
Multi-chip semiconductor package and fabrication method thereof
ULTRATERA CORP1 citations49
UTAC TAIWAN CORP
3 patentsUS7859118B2Dec 28, 2010
Multi-substrate region-based package and method for fabricating the same
UTAC TAIWAN CORP9 citations82
US7993970B2Aug 9, 2011
Semiconductor device and fabrication method thereof
UTAC TAIWAN CORP2 citations61
US7772034B2Aug 10, 2010
Fabrication method of semiconductor device
UTAC TAIWAN CORP1 citations50