Inventor · disambiguated record
Boe Su
Also filed as: SU BOE
3 granted patents·2 pending applications·236 citations·filing 2004–2008
77Inventor score
Top patents by PatentIndex Score
5 records- 0197US7633165B2Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSVTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2008·Granted Dec 15, 2009·188 cites·18 claims
- 0280US7122458B2Method for fabricating pad redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·35 cites·17 claims
- 0363US7187078B2Bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 6, 2007·13 cites·21 claims
- 0442US2008303154A1Through-silicon via interconnection formed with a cap layerHUANG HON-LIN·Filed 2007·Application pending·0 cites
- 0536US2006046434A1Method for reducing lead precipitation during wafer processingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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