Inventor
YOON IN SANG
KR33 patents
⚠️ This page may combine multiple inventors who share the name “YOON IN SANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YOON IN SANG
9 patentsUS8409917B2Apr 2, 2013
Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
YOON IN SANG19 citations92
US8299595B2Oct 30, 2012
Integrated circuit package system with package stacking and method of manufacture thereof
YOON IN SANG38 citations92
US8765525B2Jul 1, 2014
Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer
YOON IN SANG8 citations84
US8124459B2Feb 28, 2012
Bump chip carrier semiconductor package system
YOON IN SANG11 citations83
US9385066B1Jul 5, 2016
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
YOON IN SANG4 citations73
US8497575B2Jul 30, 2013
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof
YOON IN SANG6 citations73
US8130512B2Mar 6, 2012
Integrated circuit package system and method of package stacking
YOON IN SANG6 citations73
US9905491B1Feb 27, 2018
Interposer substrate designs for semiconductor packages
YOON IN SANG5 citations72
US8247894B2Aug 21, 2012
Integrated circuit package system with step mold recess
YOON IN SANG6 citations72
STATS CHIPPAC LTD
5 patentsUS8035210B2Oct 11, 2011
Integrated circuit package system with interposer
STATS CHIPPAC LTD27 citations92
US7800212B2Sep 21, 2010
Mountable integrated circuit package system with stacking interposer
STATS CHIPPAC LTD24 citations92
US7667314B2Feb 23, 2010
Integrated circuit package system with mold lock subassembly
STATS CHIPPAC LTD5 citations62
US7875967B2Jan 25, 2011
Integrated circuit with step molded inner stacking module package in package system
STATS CHIPPAC LTD0 citations52
US8367465B2Feb 5, 2013
Integrated circuit package on package system
STATS CHIPPAC LTD0 citations41
STATS CHIPPAC PTE LTD
4 patentsUS9997468B2Jun 12, 2018
Integrated circuit packaging system with shielding and method of manufacturing thereof
STATS CHIPPAC PTE LTD5 citations84
US10083903B1Sep 25, 2018
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
STATS CHIPPAC PTE LTD1 citations63
US11145603B2Oct 12, 2021
Integrated circuit packaging system with shielding and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations62
US11024585B2Jun 1, 2021
Integrated circuit packaging system with shielding and method of manufacture thereof
STATS CHIPPAC PTE LTD0 citations62