Inventor
WANG CHUNG YU
TW37 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHUNG YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
16 patentsUS7361990B2Apr 22, 2008
Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads
TAIWAN SEMICONDUCTOR MFG134 citations98
US6787926B2Sep 7, 2004
Wire stitch bond on an integrated circuit bond pad and method of making the same
TAIWAN SEMICONDUCTOR MFG85 citations98
US6770958B2Aug 3, 2004
Under bump metallization structure
TAIWAN SEMICONDUCTOR MFG80 citations98
US6596619B1Jul 22, 2003
Method for fabricating an under bump metallization structure
TAIWAN SEMICONDUCTOR MFG48 citations96
US6528417B1Mar 4, 2003
Metal patterned structure for SiN surface adhesion enhancement
TAIWAN SEMICONDUCTOR MFG24 citations93
US7112522B1Sep 26, 2006
Method to increase bump height and achieve robust bump structure
TAIWAN SEMICONDUCTOR MFG25 citations92
US6782897B2Aug 31, 2004
Method of protecting a passivation layer during solder bump formation
TAIWAN SEMICONDUCTOR MFG52 citations92
US9337096B2May 10, 2016
Apparatus and methods for molding die on wafer interposers
TAIWAN SEMICONDUCTOR MFG12 citations84
US6774026B1Aug 10, 2004
Structure and method for low-stress concentration solder bumps
TAIWAN SEMICONDUCTOR MFG14 citations84
US9337063B2May 10, 2016
Package for three dimensional integrated circuit
TAIWAN SEMICONDUCTOR MFG8 citations83
US7446398B2Nov 4, 2008
Bump pattern design for flip chip semiconductor package
TAIWAN SEMICONDUCTOR MFG15 citations82
US9136211B2Sep 15, 2015
Protected solder ball joints in wafer level chip-scale packaging
TAIWAN SEMICONDUCTOR MFG5 citations73
US7443010B2Oct 28, 2008
Matrix form semiconductor package substrate having an electrode of serpentine shape
TAIWAN SEMICONDUCTOR MFG6 citations63
US8946893B2Feb 3, 2015
Apparatus for dicing interposer assembly
TAIWAN SEMICONDUCTOR MFG0 citations52
US7833896B2Nov 16, 2010
Aluminum cap for reducing scratch and wire-bond bridging of bond pads
TAIWAN SEMICONDUCTOR MFG0 citations42
US7662665B2Feb 16, 2010
Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging
TAIWAN SEMICONDUCTOR MFG0 citations42
WANG CHUNG YU
11 patentsUS8183579B2May 22, 2012
LED flip-chip package structure with dummy bumps
WANG CHUNG YU133 citations99
US8183578B2May 22, 2012
Double flip-chip LED package components
WANG CHUNG YU136 citations98
US8580683B2Nov 12, 2013
Apparatus and methods for molding die on wafer interposers
WANG CHUNG YU20 citations92
US8900893B2Dec 2, 2014
Vertical LED chip package on TSV carrier
WANG CHUNG YU6 citations84
US8501590B2Aug 6, 2013
Apparatus and methods for dicing interposer assembly
WANG CHUNG YU8 citations84
US8390009B2Mar 5, 2013
Light-emitting diode (LED) package systems
WANG CHUNG YU11 citations84
US8492263B2Jul 23, 2013
Protected solder ball joints in wafer level chip-scale packaging
WANG CHUNG YU11 citations83
US8183580B2May 22, 2012
Thermally-enhanced hybrid LED package components
WANG CHUNG YU6 citations73
US8816495B2Aug 26, 2014
Structures and formation methods of packages with heat sinks
WANG CHUNG YU2 citations62
US8642390B2Feb 4, 2014
Tape residue-free bump area after wafer back grinding
WANG CHUNG YU1 citations51
US8629043B2Jan 14, 2014
Methods for de-bonding carriers
WANG CHUNG YU0 citations50