Wafer level reflector for LED packaging

Abstract

An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

What is claimed is: 
     
       1. An apparatus, comprising:
 a package wafer; 
 a light-emitting diode (LED) die disposed on the package wafer; 
 a phosphor coating covering the LED die conformally; 
 a molded lens disposed over the package wafer, wherein the LED die and the phosphor coating are housed under the molded lens; and 
 a molded reflector disposed over the package wafer and formed a cavity, wherein the LED, the phosphor coating, and the molded lens are located in the cavity and spaced apart from the molded reflector, wherein the molded reflector has a sloped cross-sectional profile such that light emitted by the LED die can be reflected by the molded reflectors in a direction away from the package wafer.