Inventor · disambiguated record
Hsiao-Wen Lee
Also filed as: LEE HSIAO WEN
105 granted patents·33 pending applications·390 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD67VISERA TECHNOLOGIES CO LTD14TSMC SOLID STATE LIGHTING LTD13LEE HSIAO-WEN10IND TECH RES INST8
Top patents by PatentIndex Score
138 records- 0198US11387341B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0297US12408314B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·2 cites·20 claims
- 0397US11756928B2Multi-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 0496US12040359B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·2 cites·20 claims
- 0596US10763239B2Multi-chip wafer level packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·13 cites·17 claims
- 0695US12381180B2Multi-chip packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·1 cites·20 claims
- 0795US11961899B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 16, 2024·2 cites·20 claims
- 0895US11563105B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 24, 2023·3 cites·20 claims
- 0994US11855179B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 1094US8969894B2Light emitting diode with a micro-structure lens having a ridged surfaceLEE HSIAO-WEN·Filed 2011·Granted Mar 3, 2015·16 cites·20 claims
- 1193US11437327B2Integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 1292US11552195B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·2 cites·10 claims
- 1392US9899443B2Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image bufferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·9 cites·20 claims
- 1491US11189596B2Methods of forming multi-chip wafer level packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 1591US7521724B2Light emitting diode package and process of making the sameIND TECH RES INST·Filed 2005·Granted Apr 21, 2009·26 cites·37 claims
- 1690US10529671B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·5 cites·20 claims
- 1788US8757845B2Wide angle based indoor lighting lampTSENG CHI XIANG·Filed 2011·Granted Jun 24, 2014·9 cites·22 claims
- 1888US6496466B1Folding mirror structureIND TECH RES INST·Filed 2000·Granted Dec 17, 2002·28 cites·12 claims
- 1987US9024341B2Refractive index tuning of wafer level package LEDsLEE HSIAO-WEN·Filed 2010·Granted May 5, 2015·7 cites·20 claims
- 2087US7433555B2Optoelectronic device chip having a composite spacer structure and method making sameVISERA TECHNOLOGIES CO LTD·Filed 2006·Granted Oct 7, 2008·16 cites·7 claims
- 2187US2025324737A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2286US12389628B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 2386US12363995B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2486US12211919B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
- 2586US8889439B2Method and apparatus for packaging phosphor-coated LEDsTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Nov 18, 2014·4 cites·27 claims
- 2686US2025324652A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2786US2025142884A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2886US2025324700A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2984US12490483B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 3084US11652159B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·1 cites·20 claims
- 3184US10867930B2Integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
- 3284US9214610B2Method and apparatus for fabricating phosphor-coated LED diesTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Dec 15, 2015·4 cites·20 claims
- 3384US2025324559A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3483US12266715B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 3583US12148671B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 3683US8860056B2Structure and method for LED with phosphor coatingTSENG CHI XIANG·Filed 2011·Granted Oct 14, 2014·3 cites·22 claims
- 3783US8765500B2Method and apparatus for fabricating phosphor-coated LED diesTSENG CHI-XIANG·Filed 2012·Granted Jul 1, 2014·6 cites·20 claims
- 3883US2024379827A1Channel last process for dummy gate void defect reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3983US2025318232A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4082US12363976B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 4182US10269720B2Integrated fan-out packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·2 cites·20 claims
- 4282US7914174B2Method to optimize micro-optic lens in LED flashlight applicationVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Mar 29, 2011·13 cites·21 claims
- 4382US7741652B2Alignment device and application thereofVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Jun 22, 2010·6 cites·23 claims
- 4481US12046515B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·19 claims
- 4581US8905600B2Light-emitting diode lamp and method of makingSUN CHIH-HSUAN·Filed 2011·Granted Dec 9, 2014·6 cites·19 claims
- 4681US8835202B2Structure and method for LED with phosphor coatingTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Sep 16, 2014·2 cites·20 claims
- 4781US8647900B2Micro-structure phosphor coatingTSENG CHI XIANG·Filed 2010·Granted Feb 11, 2014·5 cites·20 claims
- 4881US8143084B2Image sensing device and manufacture method thereofLEE HSIAO-WEN·Filed 2009·Granted Mar 27, 2012·4 cites·9 claims
- 4981US7796337B2Optical microstructure plate and fabrication mold thereofVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Sep 14, 2010·4 cites·12 claims
- 5080US11942529B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →